Monitoring Inner Pressure of MEMS Devices Sealed by Wafer Bonding

Abstract

not Available.

Heat Conductivity Based Inner Cavity Pressure Monitoring and Hermeticity Monitoring for Glass Frit Wafer Bonded MEMS Devices

“…This journal paper is consolidating the work on the topic of MEMS inner pressure and hermeticity monitoring, done over more then 10 years and published ECS Symposia Semiconductor Wafer Bonding 12-14: Science, technology and application. [7][8][9] While the single publications reflect the state of this topic at time of publishing, in this paper all aspects are collected, set in relations and are supplemented with additional information (available online at stacks. iop.org/JSS/10/084006/mmedia).…”