Monitoring the Effect of Additive Agents and other Parameters on Copper Deposition by Electro Refining Process

Abbas, Hayder M.; Najim, Sarmad T.

doi:10.20546/ijcmas.2017.602.033

Cited by 5 publications

(2 citation statements)

References 7 publications

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“…These additives adsorb on the cathode surface and take part in the electrochemical crystallization process. They work toward preventing the formation of dendrites on the cathode deposit and affect its crystalline structure [ 3 , 4 , 5 ]. During the electrorefining process, copper is deposited on the cathode in the form of crystals, which tend to grow into irregular shapes in the form of balls, cones, and thick growths, known as dendrites.…”

Section: Introductionmentioning

confidence: 99%

Novel Additives in Copper Electrorefining—Small Laboratory Scale

Kowalik,

Kopyto,

Leszczyńska-Sejda

et al. 2024

Materials

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This research aimed to evaluate the effectiveness of new organic substances, including a novel ionic liquid based on polyhexamethylenebiguanidine, polyhexamethyleneguanidine, and safranin in the copper electrorefining process. Experiments were conducted on a small laboratory scale using industrial copper anodes. Single doses of new additives did not improve process indicators (current efficiency, average cell voltage, specific energy consumption) or the quality of copper cathode deposits. However, a combination of a new ionic liquid based on polyhexamethylenebiguanidine and thiourea resulted in a satisfactory current efficiency of 97%, an average cell voltage of 0.110 V, a low specific energy consumption index of approximately 100 kWh/tCu, and smooth cathode surfaces. These results were superior to those obtained with industrial additives (bone glue and thiourea). The findings enhance our understanding of how these substances influence the electrorefining process and suggest the potential for more efficient and sustainable methods. Further research is recommended to validate these findings and explore their industrial applications.

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Section: Introductionmentioning

confidence: 99%

Novel Additives in Copper Electrorefining—Small Laboratory Scale

Kowalik,

Kopyto,

Leszczyńska-Sejda

et al. 2024

Materials

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“…However, there are many ambiguities regarding the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness and throwing power of deposited Cu. [17][18][19][20] Therefore, in this study, the synergistic effects of these additives on the surface morphology, surface roughness, and throwing power of Cu deposited in the initial stage (Cu thickness of up to approximately 18 μm) were investigated. The throwing power was quantitatively evaluated by measuring the thickness pro le of deposited Cu.…”

Section: Introductionmentioning

confidence: 99%

Effects of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solutions

et al. 2017

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To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness, throwing power, and polarization curves for Cu deposition from electrore ning solutions, Cu electrodeposition was performed at a current density of 200 A•m −2 and a charge of 5 × 10 5 C•m −2 in an unagitated sulfate solution containing 0.708 mol•dm −3 of CuSO 4 and 2.04 mol•dm −3 of H 2 SO 4 at a temperature of 60 C. In solutions containing all three additives (gelatin, thiourea, and chloride ions), the surface roughness of deposited Cu decreased with increasing thiourea and gelatin concentrations and decreasing chloride ions concentration. On the other hand, the throwing power of deposited Cu improved with decreasing thiourea concentration and increasing gelatin concentration in solutions containing all three additives. The throwing power of deposited Cu was signi cantly improved in solutions containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solutions containing both gelatin and chloride ions, resulting in an improvement in the throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a smoothing effect is expected to result from the promotion of deposition at recesses.

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Effect of Chloride Electrolyte Additive on the Quality of Electrorefined Copper Cathode

Nkuna

Popoola

2019

Procedia Manufacturing

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Monitoring the Effect of Additive Agents and other Parameters on Copper Deposition by Electro Refining Process

Cited by 5 publications

References 7 publications

Novel Additives in Copper Electrorefining—Small Laboratory Scale

Novel Additives in Copper Electrorefining—Small Laboratory Scale

Effects of Additives on the Surface Roughness and Throwing Power of Copper Deposited from Electrorefining Solutions

Effect of Chloride Electrolyte Additive on the Quality of Electrorefined Copper Cathode

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