Monolithic 3D Integrated Circuits

Electronic devices fabricated at CMOS backend-compatible temperatures

“…chip-to-wafer, waferto-wafer and full monolithic integration) [3,7,8,[10][11][12][13][14][15][16]. Each approach uses different alignment methods, bonding techniques etc., offering different vertical interconnect densities, and hence a various degree of improvement of ICs.…”