1998
DOI: 10.1109/2944.720474
|View full text |Cite
|
Sign up to set email alerts
|

Monolithic integration via a universal damage enhanced quantum-well intermixing technique

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

1
29
0

Year Published

2003
2003
2017
2017

Publication Types

Select...
5
2
1

Relationship

2
6

Authors

Journals

citations
Cited by 98 publications
(30 citation statements)
references
References 24 publications
1
29
0
Order By: Relevance
“…Sputtering induced point defects [29]. During sputtering of a SiO 2 -layer point defects are created at the substrate surface, which can be diffused into the QWs with a thermal annealing step.…”
Section: Quantum Well Intermixingmentioning
confidence: 99%
“…Sputtering induced point defects [29]. During sputtering of a SiO 2 -layer point defects are created at the substrate surface, which can be diffused into the QWs with a thermal annealing step.…”
Section: Quantum Well Intermixingmentioning
confidence: 99%
“…The primary advantage associated with QWI is that it avoids complicated re-growth processes, and therefore is cost-effective and reliable. Indeed, QWI has been employed in various material systems for advanced optoelectonic devices and photonic integrated circuits (PICs) or optoelectronic integrated circuits (OEICs) [2,3].…”
Section: Introductionmentioning
confidence: 99%
“…Until now, there are several monolithic integration techniques that have been used in the past, such as the use of an offset QW active region [5], a butt-joint regrowth technique [6], a selective area growth (SAG) method [7] and a quantum-well intermixing (QWI) technique [3,4,8] to enable numerous components to be formed on the same chip with a common fabrication process. Selective area epitaxy as well as etching and regrowth techniques repeat the use of expensive epitaxial growth processes, thus reducing the prospects of low-cost volume production of PICs.…”
Section: Introductionmentioning
confidence: 99%