Multi-Chip Module (MCM-D) using thin film technology

Development of MCM-D Technology with Photosensitive Benzocyclobutene

“…Today most of the passive components required in electronic systems are assembled as discrete components or passive arrays. In a very high density integration IC with discrete passive components, a lot of space is required for the realization of a single inductive, capacitive or resistive function [11,12]. Even though such devices have similar frequency limitations when compared to implementations on silicon, since the parasitic effects are inherent to the construction of such devices, it is possible to achieve results comparable to what is found on state-of-the-art components, but with a much lower cost [13,14].…”

“…Following the strategy of previous papers, [16,17] MCM-D fabrication route was improved by introducing an insulation layer of BCB (photo or non photosensitive) over the Al 2 O 3 substrate. This reduces the surface roughness and allows finer structures to be microfabricated while also reducing parasitic circuit elements that may limit device speed [18].…”