2009
DOI: 10.1016/j.surfcoat.2009.02.113
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Nano-cell fabrication on semiconductor utilizing self-organizational behavior of point defects induced by ion beam

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Cited by 8 publications
(3 citation statements)
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“…GaSb において,スキャン回数を変化させたナノ セル構造の断面 SEM 像(スポット間隔 200 nm, 照射量 2×10 5 ions/spot,8×10 17 ions/m 2 /one scan) (35) .…”
Section: 図12unclassified
“…GaSb において,スキャン回数を変化させたナノ セル構造の断面 SEM 像(スポット間隔 200 nm, 照射量 2×10 5 ions/spot,8×10 17 ions/m 2 /one scan) (35) .…”
Section: 図12unclassified
“…The second step is the bottom-up migration of ion beam-induced point defects. The fabrication of ordered nanostructures containing Ge, 39) GaSb, [40][41][42][43][44][45] and InSb [46][47][48][49][50] has been attempted. However, there are limits to structure miniaturization because the ion beam diameter is large.…”
Section: Introductionmentioning
confidence: 99%
“…Their research group performed fabrication of two-dimensional nanocell lattices on GaSb, InSb and Ge wafers by FIB at room temperature and proved that this technique is suitable for application to nano-fabrication. [34][35][36][37][38][39][40][41][42][43] In particular, it was shown that in nanocell fabrication of InSb at room temperature, it is possible to fabricate an ordered two-dimensional lattice with a 100 nm cell interval free from defects such as secondary voids and to control the aspect ratio of nanocells by ion dose. 43) In order to control the dimensions of a nanocell further, and especially to achieve small diameter nanocells, it is unavoidable to accumulate knowledge of the point defects dominating nanocell formation.…”
Section: Introductionmentioning
confidence: 99%