Nano sized silver for electronic packaging

Abstract

Production of modern microelectronic devices needs advanced materials and packaging technologies oriented towards the miniaturization and high reliability of the systems. Nano sized silver can be treated as such advanced material and it is used in modern packaging technologies, especially for flexible electronics. The paper presents information about the practical use of silver particles with the size from 4 nanometers in materials for electronic packaging technologies.The special ink containing nanosilver is use for ink-jet printing electrically conductive structures. Such process can be applied for flexible electronics even when structures are printed on temperature sensitive materials. Ink-jet printing may be used for creating the conductive layers of microvias joining both sides of flexible substrates with acceptable level of resistance. Nano sized silver is also used as a component of hybrid filler for electrically and thermally conductive polymer based composites, although the role of nanosilver particles in transport of current or heat in such materials is limited. Nanosilver plays an increasingly important role in joints elements working at high temperatures. The sintering process is done at temperatures significantly below 300 °C and the highest shear strength of joined elements reached several dozens of MPa.J. Felba is with the Faculty

Influence of sintering process parameters on mechanical strength of joints based on silver nano particles

“…The previous studies [5] on material contained Ag nanoparticles with narrow size distribution from 3-10 nm in form of ink for ink-jet printed technology (ink AX JP-6n developed by Amepox Microelectronics LTD) showed that the low pressure or even pressure-free sintering process is possible. The experimental results on measurement of resistance change of ink-jet printed structures sintered in different temperatures showed that the sintering process time strongly depends on temperature.…”

“…In novel colloid developed by Amepox the silver nanoparticles are covered with different (polymer) coating and the mean size of particles is about 70nm. Even the size of Ag nanoparticles is one order of magnitude higher than in previous ink, the sintering process of such material would be carried out in lower temperature (150 °C) during 1h [5,[9][10][11] giving similar value of electrical conductivity.…”