Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles

Yakymovych, A.; Plevachuk, Yu.; Orovčík, Ľubomír; Švec, P.

doi:10.1007/s13204-021-01750-6

Cited by 7 publications

(3 citation statements)

References 16 publications

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“…It was revealed that nanosized impurities have even more positive effect on increasing the strength of solder joints. This statement was also confirmed by our previous studies, devoted to the influence of nanosized metal Co (Yakymovych et al 2017a , b ), Co-Pd (Yakymovych et al 2020 ), Ni (Yakymovych et al 2017a ), Ni–Sn (Yakymovych et al 2018 ; Yakymovych et al 2022 ) as well as ceramic Al 2 O 3 , SiO 2 , TiO 2 , and ZrO 2 (Yakymovych et al 2016 ; Aspalter et al 2020 ) admixtures on physical properties and the microstructure of Sn–Ag–Cu-based solders. Since shear strength is one of the key mechanical characteristics that ensure the reliability of soldered joints, its improvement is of particular interest and importance.…”

Section: Introductionsupporting

confidence: 79%

Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

et al. 2023

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An influence of carbon nanotubes and carbon nanospheres coated by Au–Pd and Pt on the microstructure of solder/copper joints at room temperature and after aging at sub-zero temperature. The carbon nanosized admixtures were mixed with ternary Sn3.0Ag0.5Cu matrix to prepare a composite solder. The microstructure of the solder joints between the nanocomposite solders and a copper substrate was studied by scanning electron microscopy. It was found that minor (0.05 wt. %) admixtures of both the carbon nanospheres and nanotubes increase the shear strength of the solder joints and reduce the growth rate of the intermetallic Cu6Sn5 layer, formed at the interface between solder and copper. This effect may be related to the adsorption of nanoinclusions on the grain surface during the solidification process. Comparative analysis suggests that exposure for 2 months at 253 K does not lead to deterioration of such an important mechanical characteristic of the solder joint as shear strength, indicating the possibility of using these nanocomposite solders in microelectronic equipment even at temperatures below 0 ℃.

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Section: Introductionsupporting

confidence: 79%

Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

et al. 2023

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“…The reinforced microstructure, especially at the solder/substrate interface for the nanocomposite solder joints reinforced with nanoNi, is related to a transition of the interfacial IMCs from the scallop-type morphology of the Cu 6 Sn 5 to a more planar type due to the substitution of Cu by Ni atoms in the Cu 6 Sn 5 compound. Structural studies of the as-reflowed and thermally aged nanocomposite SAC305 solders joints showed that additions of nanosized Ni, Ni 3 Sn, and Ni 3 Sn 2 inclusions to the SAC305 solder paste led to a decrease in the average thickness of the intermetallic compound layer in the interface between the solder and the substrate compared to the corresponding produced unreinforced solder joint [15,17]. A refinement of the microstructure of the Sn-based solders after minor additions of nanosized Ni powder was also found in the case of the Sn-9Zn, Sn-8Zn-3Bi [18], and Sn-35Bi-1Ag solders [19].…”

Section: Introductionmentioning

confidence: 99%

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Yakymovych

Shtablavyi

2023

Metals

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The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in manufacturing small electronic products and device miniaturization faces some disadvantages in terms of mechanical properties and their higher melting temperatures compared to Pb-Sn solders, prompting new research relating to the reinforcement of existing SAC solders. The current study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100−x(nanoNi)x solders with 0.5 wt.%, 1.0 wt.%, and 2.0 wt.% Ni. Structural analysis of the investigated samples were performed by means of X-ray diffraction in a liquid state and scanning electron microscopy (SEM). SEM showed the mutual substitution of Ni and Cu atoms in the Cu6Sn5 and Ni3Sn4 phases, respectively. The performed structural studies in liquid and solid states provided essential information concerning the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor additions of nanosized Ni powder. The melting point and degree of undercooling of the samples were investigated by DTA analysis.

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“…However, due to the non-negligible risks of lead to the human body and environment, lead is required to be removed from electronic products. Currently, many lead-free solders have been studied in various fields as alternatives to Sn-Pb solders, such as Sn-Ag-Cu [ 1 , 2 ], Sn-Bi [ 3 , 4 ], Sn-Zn [ 5 ], Sn-Cu [ 6 ], Sn-In [ 7 ], and so on. Among them, the Sn-Bi series has been extensively studied by researchers for its lower cost and good wettability [ 8 , 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

Yang

Qin

Feng³

et al. 2023

Materials

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The application of Sn-Bi series solder is limited due to the brittleness of Bi phase. Sn-20Bi solder with less Bi element content has great research prospects, but it needs modification to make it a substitute for traditional Sn-Pb solder. In this article, we mixed graphene nanosheets with nanometer Sn powder by means of ultrasonic oscillation, and Sn-20Bi-qGNS (q = 0.01, 0.02, 0.04, 0.06, and 0.1 wt.%) solder alloys were prepared by the melt-casting method. The effects of graphene nanosheets (GNSs) on the microstructure, physical properties, mechanical properties, and corrosion resistance of solder alloys were investigated. Scanning electron microscopy, energy dispersive spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to determine the microstructural morphology and composition. The results showed that the melting point, density, and wettability of the solder decreased slightly with the addition of GNSs. The addition of GNSs as a second phase refined the solder structure and improved the tensile strength of the molten Sn-20Bi composite solder to 99.6 MPa, while elongation decreased with the addition of GNSs. Furthermore, GNSs prevented the MC Sn-20Bi-qGNSs/Cu intermetallic compound layers’ growth by interfering with atomic diffusion and grain boundary movement. In addition, the addition of 0.02 wt.% GNSs enhanced the shear strength of MC Sn-20Bi solder joints to 46.3 MPa. The electrochemical experimental results show that the surface corrosion products of MC Sn-20Bi-qGNSs under 3.5% NaCl solution were Sn3O(OH)2Cl2, with MC Sn-20Bi-0.01GNSs exhibiting the best corrosion resistance.

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Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles

Cited by 7 publications

References 16 publications

Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder

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