Fabricating ultrathin silicon (Si) channels down to critical dimension (CD) <10 nm, a key capability to implementing cutting‐edge microelectronics and quantum charge‐qubits, has never been accomplished via an extremely low‐cost catalytic growth. In this work, 3D stacked ultrathin Si nanowires (SiNWs) are demonstrated, with width and height of Wnw = 9.9 ± 1.2 nm (down to 8 nm) and Hnw = 18.8 ± 1.8 nm, that can be reliably grown into the ultrafine sidewall grooves, approaching to the CD of 10 nm technology node, thanks to a new self‐delimited droplet control strategy. Interestingly, the cross‐sections of the as‐grown SiNW channels can also be easily tailored from fin‐like to sheet‐like geometries by tuning the groove profile, while a sharply folding guided growth indicates a unique capability to produce closely‐packed multiple rows of stacked SiNWs, out of a single run growth, with the minimal use of catalyst metal. Prototype field effect transistors are also successfully fabricated, achieving Ion/off ratio and sub‐threshold swing of >106 and 125 mV dec−1, respectively. These results highlight the unexplored potential of versatile catalytic growth to compete with, or complement, the advanced top‐down etching technology in the exploitation of monolithic 3D integration of logic‐in‐memory, neuromorphic and charge‐qubit applications.