NanoFlux &amp;#x2014; doping of solder pastes

Zerrer, Patrick; Fix, Andreas; Hütter, Matthias; Pape, Uwe

doi:10.1109/estc.2008.4684475

Cited by 4 publications

(5 citation statements)

References 10 publications

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“…It is a simple method which is gaining increasing attention [24,25]. This is because this method can be used in the conventional reflow process using the existing industrial infrastructure.…”

Section: Resultsmentioning

confidence: 99%

Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

Haseeb

Leng

2011

Intermetallics

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Section: Resultsmentioning

confidence: 99%

Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

Haseeb

Leng

2011

Intermetallics

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“…In the following the impact of the metal organic compounds on the melting and the solidification behaviour of the solder alloys is presented. Successful doping was presented in a previous publication (Zerrer et al , 2008), the amount of transferred dopants in weight per cent is shown in Table II.…”

Section: Resultsmentioning

confidence: 76%

“…Successful doping was presented in a previous publication (Zerrer et al, 2008), the amount of transferred dopants in weight per cent is shown in Table II.…”

Section: Resultsmentioning

confidence: 83%

“…When looking at the in situ experiments, the solidification was promoted, too. This explains the refined solder joints resented on PCBs (Zerrer et al , 2008) which is promising for a higher reliability (Song et al , 2006). Also, the wetting behaviour is not affected by Co, as is shown in Figure 4.…”

Section: Discussionmentioning

confidence: 98%

“…Consequently, an in situ alloying of a standard solder powder by a chemical reactive flux containing Co, Fe and Al was investigated. After proving a successful doping (Zerrer et al , 2008), this paper focuses on the melting and solidification behaviour of the new solder. Differential scanning calorimetery (DSC) experiments were carried out to investigate single and multiple reflow and soldering in situ on a copper pads.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux

Zerrer

Fix²,

Hütter³

et al. 2010

Soldering & Surface Mount Tech

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Purpose -The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes. Design/methodology/approach -This paper presents the impact of six metal organic compounds (Co, Fe, Al; stearate, oxalate, citrate) on the melting and solidification behaviour in comparison to the revealed microstructure. Findings -It could be shown that Co and Al influence the supercooling whereas Fe exhibits no effect. Co reduces the supercooling of the cast of about 10 K and affects the nucleation. Al retards the solidification up to 1858C. Doping of the solder by flux containing metal organic compounds is successful and the alloying elements Co and Fe are found in the microstructure. Research limitations/implications -This paper provides a starting-point for the new alloying method -so far only fluxes for solder pastes have been investigated. Originality/value -The reactive alloying method enables the use of new alloying elements for solder pastes in unmodified soldering processes.

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Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints

Hütter

Schmidt

Zerrer

et al. 2009

2009 59th Electronic Components and Technology Conference

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The electronics industry has successfully transitioned to lead free soldering for computer and consumer products while in the automotive industry due to the very high reliability requirements this step is still in an ongoing process. In order to ensure or even to enhance the reliability of electronics the improvement of lead free solder joints based on Sn-Ag-Cu (SAC) solder has been the focus of many research projects already. One approach to improve the thermal fatigue properties of these alloys is to add a further alloying element SAC + X. Until now, further elements have mainly been added by metallurgical alloying, requiring special equipment and conditions. The powder production is even more difficult. In this paper a new way how to add minor amounts around 0.1 wt.-% of a forth element to SAC solder joints is presented. One possibility is to do the doping during the reflow process adding the additional elements via the flux by incorporating Co-, Fe-, Al- or other metal compounds into the flux. Experiments have shown that Co and Fe were successfully added while for certain other elements like for example Al this was not possible until now. In comparison to standard SAC solder the Co containing solder shows a refined microstructure and Co is found in the intermetallic phase Cu6Sn5. Fe which has been found at gain boundaries is not only attractive as alloying element but as metallization layer, too. It is possible to deposit Fe on printed circuit boards using electroplating. During soldering the slowly growing FeSn2 phase forms between the solder and the Fe layer

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NanoFlux — doping of solder pastes

Cited by 4 publications

References 10 publications

Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

Effects of Co nanoparticle addition to Sn–3.8Ag–0.7Cu solder on interfacial structure after reflow and ageing

Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux

Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints

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