Nanogrinding of soft–brittle monocrystalline mercury cadmium telluride using a ceramic bond ultrafine diamond grinding wheel

Abstract

Nanogrinding experiments on soft-brittle monocrystalline mercury cadmium telluride (HgCdTe, MCT) were conducted using a novel developed ceramic bond ultrafine diamond grinding wheel. The experimental results showed that the ultrafine grinding wheel exhibited excellent grinding performance on HgCdTe wafers. Surface roughness Ra 1.4 nm, rms 1.7 nm, and PV 10.9 nm were respectively achieved under nanogrinding using this diamond grinding wheel. All the ground surfaces of MCT wafers exhibited ductile mode character, free of cracking and burn damage. The nanogrinding results were discussed in terms of the ceramic bond, as well as maximum undeformed chip thickness.

Preparation and characterization of ultra-thin dicing blades with different bonding properties

“…However it is a paradox that one dicing blade presents both high cutting quality and high service life due to so complex influence factors including the materials of workpiece, the size and shape of abrasive, the distribution of abrasive size, matrix, the hardness of dicing blade, porosity, the bonding strength of grains and matrix, microstructure of dicing blade and dicing parameters. To improve the cutting properties, four types of dicing blades including metal binder [12], resin binder [9], ceramic binder [11] and electroplated nickel binding agent [10] are usually produced.…”