2015
DOI: 10.1016/j.jallcom.2014.09.028
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Nanomechanical properties of Bi2Te3 thin films by nanoindentation

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Cited by 26 publications
(19 citation statements)
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“…Bismuth telluride (Bi 2 Te 3 )-based TE alloys exhibit the lowest and highest reported elastic modulus values, as low as ~40 GPa and up to ~200 GPa, depending on the exact alloying and fabrication procedure [12,18]. Lead telluride (PbTe)-based alloys (which is the most researched alloy system) exhibit modulus values of ~60 GPa [1].…”
Section: Elastic Modulusmentioning
confidence: 99%
“…Bismuth telluride (Bi 2 Te 3 )-based TE alloys exhibit the lowest and highest reported elastic modulus values, as low as ~40 GPa and up to ~200 GPa, depending on the exact alloying and fabrication procedure [12,18]. Lead telluride (PbTe)-based alloys (which is the most researched alloy system) exhibit modulus values of ~60 GPa [1].…”
Section: Elastic Modulusmentioning
confidence: 99%
“…However, the occurrence of vacancies shifts the Fermi level from the bulk band gap and induces the formation of BiO bonds , while surface oxidation implies the degradation of the peculiar electronic properties of TIs . Moreover, crystal defects, whose amount is relatively large in some of the above‐mentioned growth processes, could also have a detrimental effect on the mechanical properties . Therefore, TIs displaying high amount of crystal defects cannot be successfully employed in technological applications.…”
Section: Introductionmentioning
confidence: 99%
“…Previous related works on Bi 2 Te 3 TIs were mostly focused on the optoelectronic and thermoelectric properties , while there is a relative lack of research efforts devoted to the mechanical characterization. Indeed, only a few contributions addressed this topic and analyzed Bi 2 Te 3 nanosheets and thin films , while none of them dealt with Bi 2 Te 3 single crystals. However, knowledge of the mechanical properties is required in order to design structural/functional elements operating at the nanoscale, such as nanoelectromechanical systems (NEMS), flexible electronics devices , and TI‐based mechanical metamaterials .…”
Section: Introductionmentioning
confidence: 99%
“…The elastic modulus (Ei) and Poisson ratio (υi) of the Berkovich indenter used in this study were 1141 GPa and 0.07, respectively [34]. The υf was assumed to be 0.25 by referencing the Poisson’s ratio of thin films [29,41,42].…”
Section: Resultsmentioning
confidence: 99%