2022
DOI: 10.1109/led.2021.3136875
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Nanoscale Vacuum Field Emission Triode With a Double Gate Structure

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Cited by 11 publications
(7 citation statements)
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“…It is noted that the NACTs with sub‐MFP air channels exhibiting excellent field emission performance have been created using IC‐compatible methods. Among them, our device has a relatively low V on and an outstanding field emission current of 11.7 mA@10 V, which is much higher than the previous reported NACTs [ 10 ] (generally much less than 1 mA@10 V). There are three possible explanations for the high output current of our GaN NACD.…”
Section: Resultsmentioning
confidence: 67%
“…It is noted that the NACTs with sub‐MFP air channels exhibiting excellent field emission performance have been created using IC‐compatible methods. Among them, our device has a relatively low V on and an outstanding field emission current of 11.7 mA@10 V, which is much higher than the previous reported NACTs [ 10 ] (generally much less than 1 mA@10 V). There are three possible explanations for the high output current of our GaN NACD.…”
Section: Resultsmentioning
confidence: 67%
“…Therefore, the structural parameters of the emitter/collector electrodes, such as the emitter morphology and vacuum channel length, could extensively influence the emission current and operating voltage [ 20 ]. Furthermore, back-gate NVCTs are more compatible with existing IC processes, making them more attractive to researchers [ 21 , 22 , 23 ].…”
Section: Introductionmentioning
confidence: 99%
“…Historically, vacuum tubes were the primary components used in electronics until being gradually replaced by solid-state electronics which have the advantages of integration, miniaturization, power efficiency, and low cost . Recently, the emergence of micro-/nanoscale manufacturing technologies has led to a resurgence of interest in vacuum electronics, resulting in the development of a novel device known as nanoscale air channel device (NACD). , The critical channel length of the NACD, achieved using technologies such as electron beam lithography (EBL), , focused ion beam (FIB) etching, , electro-forming, buffered oxide etch (BOE), , and so forth, is close to or less than the mean free path (MFP) (≈68 nm) of air at room temperature and pressure (RTP). This enables the electrons to be transported ballistically without scattering in the air channel.…”
Section: Introductionmentioning
confidence: 99%