Nanowire ACF for Ultrafine-Pitch Flip-Chip Interconnection

Razeeb, Kafil M.; Tao, Jing; Stam, Frank

doi:10.1007/978-3-319-90362-0_22

Cited by 4 publications

(2 citation statements)

References 68 publications

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“…Conductive bonding technologies for electrodes on different flexible substrates include soldering, bonding via adhesive surrounded by conductive bumps (12,13), and the use of conductive solutions or composites of conductive filler mixed with adhesive (12,14,15). In these methods, heating and pressurization processes are usually required to cure the adhesive (or liquefy it in the case of solder) and achieve highly conductive bonds.…”

Section: Introductionmentioning

confidence: 99%

Direct gold bonding for flexible integrated electronics

et al. 2021

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Section: Introductionmentioning

confidence: 99%

Direct gold bonding for flexible integrated electronics

et al. 2021

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“…107,108 ACF/ACA, which contains the conductive filler into an insulating polymer adhesive, develops the conductive pass between electrodes by sandwiching the conductive filler between electrodes under heat (room temperature ~200°C) and pressure (2-5 MPa). 109 This method is versatile, and multiple electrodes, such as the anode and cathode, can be bonded simultaneously because of many candidate materials that can be bonded and one-way conductive pass. The current research related to the ACF/ACA could achieve 10 um of high-resolution bonding pitch owing to UV-cured insulating adhesive with reducing conductive filler diameter.…”

Section: Integration Strategy Of Ultraflexible Organic Electronics Fo...mentioning

confidence: 99%

Toward ultraflexible organic electronic devices

Park,

Takakuwa,

Fukuda

et al. 2023

MRS Bulletin

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In recent decades, organic electronics have progressed remarkably, owing to their exceptional mechanical and electrical properties. The development of ultraflexible organic electronics has opened up possibilities for applications such as wearable electronics, flexible displays, and skin- and tissue-compatible sensors with good breathability. In this article, we introduce state-of-the-art ultrathin and high-performance functional organic electronic devices and their integration with potential applications. Our focus is on the strategies for advancing new materials, novel device structures, and diverse applications, which have enabled the development of multifunctional and complex systems. Additionally, we highlight the challenges and opportunities for future research in this field, including improving stability and reliability over long periods, ensuring scalability and cost-effectiveness of production, and addressing issues related to integration into larger systems. Finally, we present future directions in this exciting and rapidly growing field of ultraflexible organic electronics. Graphical abstract

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Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

et al. 2020

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As electronics dramatically advance, their components should be fabricated for miniaturized scale, and integrated on limited‐size substrates with extremely high density. Current technologies for the integration and interconnection of electronics show some critical limitations in the application of microscale electronics. To address these problems, herein, a new direct and vertical interconnection driven by selective dewetting of a polymer adhesive is introduced. The interconnection system consists of the polymer adhesive and nanosized metal particles, or structured electrodes. Nanoscale‐dewetting windows formed by controlling the stability and wetting property of the adhesive polymer are controlled by the interfacial property of the coated polymer adhesive. The adhesive is coated on substrate by a simple spin‐coating process, and its ultraviolet curable property allows only the device‐mounted parts to be selectively conductive and sticky, while the other parts form insulation and protection layers. The interconnection of the electronics and substrate by adhesive makes it possible to apply the technique to various microsize electronics with electrode size and pitch of 20 µm or less, and endure dramatic temperature change and a long‐term high humidity environment. Moreover, over display comprising over 10 000 microscale light‐emitting diodes (micro‐LEDs), and commercialized microchips are demonstrated with monolithic integration on flexible and transparent substrate.

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Nanowire ACF for Ultrafine-Pitch Flip-Chip Interconnection

Cited by 4 publications

References 68 publications

Direct gold bonding for flexible integrated electronics

Direct gold bonding for flexible integrated electronics

Toward ultraflexible organic electronic devices

Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing

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