“…1,[21][22][23][24] For the high resolution images, several researchers prepared firstly the cross section of a single splat by a conventional polishing method using silicon carbide (SiC) papers or the FIB method and then, from the cross section, several TEM samples were made respectively at desired locations within the single splat. [27][28][29] Once a TEM sample was made and observed, it is generally impossible to prepare much thinner sample at the desired position. By the FIB milling, however, it is possible to conduct re-thinning at any interested region even after TEM samples were already observed by electron microscopes.…”