New Laser Cutting Technology of Sapphire Wafers on Crystals

Кондратенко, В. С.; Borisovskiy, Vladimir Yevgenievich; Naumov, A. S.

doi:10.4028/www.scientific.net/amr.660.30

Cited by 2 publications

(1 citation statement)

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“…In LIBS, the double-pulse laser can blend laser energy into the material more effectively [7,8]. Kondratenko V. S. et al [9] are devoted to developing new cutting technologies for semiconductor wafers on crystals using laser-controlled thermocracking. Some scholars have researched sapphire cutting by means of a femtosecond laser [10] and a picosecond laser [11].…”

Section: Introductionmentioning

confidence: 99%

A Numerical Simulation and Experimental Study on the Ultrafast Double-Laser Precision Cutting of Sapphire Materials

et al. 2022

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To effectively improve the cutting quality of sapphire and optimize ultrafast picosecond laser cutting technology, this paper presents a new numerical simulation method and an experimental study of the ultrafast double-laser cutting of sapphire materials. The optimal cutting technology and the numerical simulation of the temperature field of the ultrafast picosecond laser cutting of sapphire were designed independently. The principle is based on double-laser-beam cutting using an ultrashort pulse and a CO2 beam; the ultrashort pulse is focused on the material through a laser filamentous cutting head and perforated, and it moves at a speed of up to 200 mm/s to form the desired cutting line. Then, a CO2 beam is used for heating, and the principle of heat bilges and cold shrink causes the rapid separation of products. Furthermore, an SEM tester was used to characterize and analyze the microstructure and properties of sapphire materials. A microscope was used to analyze the composition of the cutting micro-area and explore the general mechanism of laser cutting sapphire. The results showed that the proposed method greatly improves efficiency and precision; in addition, the chipping size of sapphire is less than 4μm.

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