New Photosensitive High Temperature Polymers for Electronic Applications

Yoda, Naoya; Hiramoto, Hiroo

doi:10.1080/00222338408082082

Cited by 145 publications

(54 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…They are also attractive since they simplify processing and avoid the use of photoresist in the microelectric industry. Most of the photosensitive polyimides are prepared from polyamic acids, where crosslinking sites are introduced to amic acids through ester [1] and acid-amine ion linkages [2]. Such negative-type polyimides are commercially available.…”

Section: Introductionmentioning

confidence: 99%

Positive-Working Alkaline-Developable Photosensitive Polyimide Precursor Based on Poly(amic acid) and Dissolution Inhibitor.

Haba

Okazaki

Nakayama

et al. 1997

J. Photopol. Sci. Technol.

View full text Add to dashboard Cite

A poly(amic acid) (PAA) was prepared by ring-opening polyaddition of 4,4'-hexafluoroisopropyridenebis(phthalic anhydride) and 1,3-bis(4-aminophenoxy)benzene. The PAA film was very soluble to a tetramethylammonium hydroxide (TMAH) aqueous solution, whereas the dissolution inhibitor, 2,3,4-tris(1-oxo-2-diazonaphthoquinone-5-sulfonyloxy)-benzophenone (D5SB) effectively suppresses the solubility. This film could lead to polyimide exhibiting good thermal stability. An UV-vis.spectrum of the PAA film indicated excellent tranceparency to i-line (365 nm) and the PAA containing 20 wt% of D5SB showed a sensitivity of 100 mJicm2 and contrast of 7. 1, after exposed to i-line followed by developing with a 0.1 % TMAH aq. at room temperture. When this pattern printed film was heated at 200 °C for 24 hour to derive polyimide film, the pattern was maintained without any flow through the imidization.

show abstract

Section: Introductionmentioning

confidence: 99%

Positive-Working Alkaline-Developable Photosensitive Polyimide Precursor Based on Poly(amic acid) and Dissolution Inhibitor.

Haba

Okazaki

Nakayama

et al. 1997

J. Photopol. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…Most commercial PSPIs are based on polyamic acid (PAA) where cross-linking sites are introduced to amic acids through ester [3] and acid-amine ion linkages [4] as shown in eq. (1).…”

Section: Negative-type Photosensitive-polyimidementioning

confidence: 99%

Recent Development in Photosensitive Polyimide (PSPI)

Mochizuki

Ueda

2001

J. Photopol. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…In addition, to simplify opening connection via or bonding windows, photosensitive PI (PSPI) and PBO (PSPBO) have become popular due to the elimination of photo-resist processes [3][4][5]. On the other hand, in order to shrink chip size and improve various performances of the chip, the design rule for the semiconductor chip is getting smaller.…”

Section: Introductionmentioning

confidence: 99%