New poly(amide-imide)s syntheses. XXIII. Synthesis and properties of poly(amide-imide)s derived from 4,4?-[1,4-phenylenebis(isopropylidene-1,4-phenyleneoxy)]dianiline and various bis(trimellitimide)s

Yang, Chin‐Ping; Hsiao, Sheng‐Huei; Hsiao, Hsiu‐Chun

doi:10.1002/(sici)1099-0518(19990101)37:1<69::aid-pola8>3.0.co;2-4

Cited by 17 publications

(15 citation statements)

References 30 publications

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“…On heating, PAA is converted to poly(amide‐imide) (PAI), a material of high thermal resistance and strength material. These properties are conferred by its high proportion of aromatic rings, double bonds, and heterocyclic imides along the polymer backbone 10–12. Park et al13 investigated the effect of PAI addition (as a modifier) to the thermal, mechanical, and morphological properties of TGDDM/DDS blends.…”

Section: Introductionmentioning

confidence: 99%

Cure and thermal stability of poly(amide‐amidic acid)—cured tetraglycidyl 4,4′‐diaminodiphenylmethane

Chen

Lü

et al. 2012

J of Applied Polymer Sci

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A novel curing agent, poly (amide-amidic acid) (PAA), was used to cure tetraglycidyl 4,4 0 -diaminodiphenylmethane (TGDDM). The initial cure and exothermic peak temperatures increased with increase in PAA content. The mechanism for the cure of TGDDM/PAA was proposed which involved, besides TGDDM cure, PAA imidization in the system. Examination of the morphology of the fractured surface using scanning electron microscopy showed that curing with PAA improved more the fracture toughness as compared to the conventional 4,4 0 -diaminodiphenylsulfone (DDS), and rendered TGDDM more fire resistant with higher char yield.

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Section: Introductionmentioning

confidence: 99%

Cure and thermal stability of poly(amide‐amidic acid)—cured tetraglycidyl 4,4′‐diaminodiphenylmethane

Chen

Lü

et al. 2012

J of Applied Polymer Sci

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“…In previous reports from our laboratory,42–44 diimide–dicarboxylic acids were synthesized as follows. A mixture of 1 mole diamine and 2 mole TMA was dissolved in DMAc or NMP before toluene was added; diimide‐dicarboxylic acid could then be obtained after water was distilled off azeotropically.…”

Section: Methodsmentioning

confidence: 99%

“…Other dicarboxylic acids II a–l were prepared according to the methods reported,42–44 and the results of the preparation were as shown in Table I.…”

Section: Methodsmentioning

confidence: 99%

Synthesis and characterization of two polytrimellitamideimide series with different segment order by direct polycondensation

Yang

Wei

2001

J of Applied Polymer Sci

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Poly(amide-imide) (PAI) could be synthesized in regular segment order from trimellitic anhydride (TMA) and various aromatic diamines. By different processes, PAI h-h-t-t containing alternating (amide-amide)-(imide-imide) sequences and PAI h-t containing amide-imide sequences could be obtained through direct polycondensation. Comparison of PAI h-h-t-t and PAI h-t , which had different sequence orders and were prepared from TMA and 12 diamines, showed that the latter had better solubility and needed less quantity of solvent and salt (CaCl 2 ) during polymerization, but both two series PAI using p-substituted diamines (e.g., p-phenylenediamine) showed poor solubility. Series PAI h-h-t-t possessed larger initial modulus but smaller elongation at break than series PAI h-t . For the thermal properties, most of series PAI h-t had glass transition temperatures higher than corresponding series PAI h-h-t-t , but these two series were similar in the 10% weight loss temperatures and the char yields at 800°C in nitrogen.

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“…However, since the residual stress is highly affected by the structure of the polymer, it is necessary to synthesize a new chemical structure to obtain a lower stress . The synthesis of poly(amide‐imide) and poly(ether‐imide) have the potential to offer a membrane with thermal stability, low residual stress, and good workability …”

Section: Introductionmentioning

confidence: 99%

The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide‐imide)s with Low Residual Stress for Microelectronic Devices

Kim

Yoo

et al. 2016

Macro Chemistry & Physics

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In this study, poly(amide-imide)s are synthesized for electronic materials by adding amide groups into polyimide. As it is expected, poly(amide-imide) shows an amorphous structure with a lower glass transition temperature and residual stress than the neat polyimide due to the high steric hindrance of the amide group. Also, the modifi cation to the polyimide structure leads to higher transmittance and enhances colorless properties. Consequently, successful synthesis of poly(amide-imide) s is demonstrated which has wide applicability in the electronic industries due to their low glass transition temperature. It is expected that semiconductor and integrated circuit products can be manufactured utilizing poly(amide-imide)s with high reliability and a low chance of cracking due to their lower residual stress. Furthermore, it envisioned that the improved optical properties of poly(amide-imide) materials will allow for their applications in transparent displays and coating products.

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New poly(amide-imide)s syntheses. XXIII. Synthesis and properties of poly(amide-imide)s derived from 4,4?-[1,4-phenylenebis(isopropylidene-1,4-phenyleneoxy)]dianiline and various bis(trimellitimide)s

Cited by 17 publications

References 30 publications

Cure and thermal stability of poly(amide‐amidic acid)—cured tetraglycidyl 4,4′‐diaminodiphenylmethane

Cure and thermal stability of poly(amide‐amidic acid)—cured tetraglycidyl 4,4′‐diaminodiphenylmethane

Synthesis and characterization of two polytrimellitamideimide series with different segment order by direct polycondensation

The Effects of Amide Groups on the Thermal and Optical Properties of Poly(amide‐imide)s with Low Residual Stress for Microelectronic Devices

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