“…For instance, [HfCl 4 ] is a lowvolatility solid which needs substrate temperatures of at least 800°C for oxide deposition, [7] making it unsuitable for many IC applications where a low thermal budget is required. The b-diketonates, [Hf(thd) 4 ] (thd = 2,2,6,6,-tetramethyl-3,5-heptanedionate), [8] [Hf(tod) 4 ] (tod = 2,7,7-trimethyl-3,5-octanedionate), [8] and [Hf(tmnd) 4 ] [9] have been investigated, but they also require relatively high growth temperatures, and oxide films deposited from b-diketonates are often contaminated with carbon. Although the nitrate complex [Hf(NO 3 ) 4 ] has been used for the MOCVD of high-purity HfO 2 films, [10,11] concerns about the stability of anhydrous metal nitrates may restrict its application.…”