Nominal power density analysis of thermoelectric pins with non-constant cross sections

Shi, Yaoguang; Mei, Deqing; Yao, Zhehe; Wang, Yancheng; Liu, Haiyan; Chen, Zichen

doi:10.1016/j.enconman.2015.02.046

Cited by 47 publications

(20 citation statements)

References 18 publications

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“…In FVM, the physical domains of the TEM, including the regions of thermoelectric legs, PDMS encapsulation, solder layer, and copper strips, are divided by non-overlapping control volumes (CVs), as shown in Figure 4A. So, the CVs of these domains (1, 3, 12 and 4, 6, 8, 10) can have larger Δy than that of thermoelectric legs (5,9) and PDMS encapsulation (2,7,11). 24 The CVs have the same length in the x direction and different lengths in the y direction, which are marked as Δx and Δy, respectively.…”

Section: Finite Volume Methodsmentioning

confidence: 99%

“…8,[11][12][13] For the designed flexible TEM, the structural of the PDMS encapsulation components may also affect the performance of the TEM. 8,[11][12][13] For the designed flexible TEM, the structural of the PDMS encapsulation components may also affect the performance of the TEM.…”

Section: Geometric Parameter's Effectmentioning

confidence: 99%

“…[11][12][13] Shi et al 11 investigated the influence of the geometric structure of thermoelectric legs on nominal power density of the TEG. [11][12][13] Shi et al 11 investigated the influence of the geometric structure of thermoelectric legs on nominal power density of the TEG.…”

Section: Introductionmentioning

confidence: 99%

“…The structural design of the thermoelectric legs has great effects on the heat transfer and output performance of the TEM, which has been confirmed. [11][12][13] Shi et al 11 investigated the influence of the geometric structure of thermoelectric legs on nominal power density of the TEG. The calculated results showed that increasing the variation of the cross-sectional area along the height of thermoelectric legs can reduce the nominal power density.…”

Section: Introductionmentioning

confidence: 99%

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Numerical modeling of the performance of thermoelectric module with polydimethylsiloxane encapsulation

et al. 2017

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Summary This paper presents a 2‐dimensional finite volume model to investigate the performance of thermoelectric module (TEM) with polydimethylsiloxane (PDMS) encapsulation. The voltage and temperature distributions of the TEM under 2 kinds of boundary conditions (constant cold‐side temperature and fixed convection heat transfer coefficient) are studied. To validate the developed model, 2 TEMs with or without PDMS encapsulation are fabricated, and the experimental tests are carried out. Both model predicted and experimentally measured results showed that using flexible PDMS as the encapsulation material for the TEM can lead majority heat flowing through thermoelectric legs and is beneficial for heat harvesting. The geometrical parameters' effects of the PDMS encapsulation and thermoelectric legs are analyzed. Results demonstrated that the usage of larger thermoelectric legs and smaller width of the PDMS encapsulation can generate greater temperature difference and hence improve the voltage of the TEM. Thus, the developed model could be applied for optimal structural design of the flexible TEM with highest performance for heat harvesting.

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Section: Finite Volume Methodsmentioning

confidence: 99%

Section: Geometric Parameter's Effectmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Numerical modeling of the performance of thermoelectric module with polydimethylsiloxane encapsulation

et al. 2017

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“…Performance of thermoelectric device is significantly affected by its geometry [22,23] and thermal boundary conditions [24][25][26]. Meng et al [27] considered multi-parameter optimization of TEG by multiphysics modeling.…”

Section: Introductionmentioning

confidence: 99%

A comparison of micro-structured flat-plate and cross-cut heat sinks for thermoelectric generation application

Rezania

Rosendahl

2015

Energy Conversion and Management

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Thermoelectric Devices: A Review of Devices, Architectures, and Contact Optimization

Schierning

Nielsch

2017

Adv Materials Technologies

321

247

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In recent years, the substantially improved performance of thermoelectric (TE) materials has attracted considerable interest in studying the potential applications of the TE technique. Serving as the bridge between TE materials and applicable TE products, TE devices must be properly designed, engineered, and assembled to meet the required performance of TE products for cooling (thermoelectric cooler) and power generation (thermoelectric generator). The principle feasibility of the TE technique has been demonstrated using a variety of different materials and processing technologies, and many different architectures of TE devices have been successfully realized. This review discusses the architectures of TE devices, including bulk and thin‐film TE devices, TE devices with flexible designs, pn‐junction‐based TE devices that provide robust solutions for high operation temperatures, and the meta‐material‐based transverse TE devices. In addition, the assembly of TE devices involves contact layers on which the reliability of TE devices depends. Thus solutions to contact issues, including bonding strength, contact resistance, and thermomechanical stress, are also reviewed.

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Nominal power density analysis of thermoelectric pins with non-constant cross sections

Cited by 47 publications

References 18 publications

Numerical modeling of the performance of thermoelectric module with polydimethylsiloxane encapsulation

Numerical modeling of the performance of thermoelectric module with polydimethylsiloxane encapsulation

A comparison of micro-structured flat-plate and cross-cut heat sinks for thermoelectric generation application

Thermoelectric Devices: A Review of Devices, Architectures, and Contact Optimization

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