Non‐Arrthenius Behaviour and Divacancy Contribution in Self‐Diffusion of ⁶⁴Cu in Cu

Abstract

The self-diffusion of W u in Cu was investigated in the high temperature range (1078 t o 1348 K), upplying the tracer-standard sectioning technique. For the frecluency factor Do and the activation energy Q, we found Do = (0.68 f_ 0 0 : : ; ) ctnZ s-I untl (5, = (2.17 f f 0.02) t:V. A slight bending of the Arrheniiis plot suggests u divacanry contribution to the self-diffusion of copper. Data sets used in an nriiiieriral analysis are in good accord with published results. Mit Hilfe des Tracer-Standardscliic.htenteiluiigsverfuhrcns wurtle clit. Selbsttliffusion von 64Cu in Cii iiii Hoc1iteniperaturbt.rc.ic.h (1078 ... 1348 K ) unterswht. Unter Verwendung clcr ,,Stu~itlurd-Ititerpretution" wurtlen fur den Frequenzfaktor Do und fur (lie Aktivierungstsnergie Qo (lie folgenden Werte ertiiittelt: Do = (0,M ~;~~) c i~~% -~; Qo = (2,17 f f 0.02) t:V. Wegen tler leichten Kriinimung der Arrhenius-Dars tc-llung wurcle eine Analyse van DoI)I'elleerstrllenbeitriigen angeschlossen. Dubei zeigtc sich, CIUR bei tler Selbstdiffusion von Kupfer neben Einfachaiich Dop~~elleerstellen~~iechltriixtnrn wirksuiii werden. Die beschreibentfen Datensiitze befinden sich in guter f'bereinstiiniiiung iiiit Literuturwerten.

Interface Controlled Diffusional Creep of Cu + 2.8 at.% Co Solid Solution

“…This activation energy is close to the volume self diffusion activation energy for pure copper. Direct radiotracer experiments give the activation energy 211 kJ/mol [8] and 209 kJ/mol [9]. It is also possible to estimate the average distance between source and sink of vacancies using the intercept on the ln(T/η) axis.…”

“…It is also possible to estimate the average distance between source and sink of vacancies using the intercept on the ln(T/η) axis. Taking into account the pre-exponential factors from [8,9] we calculated d ≈ 40 µm. The value is between the thickness foil (18 µm) and average grain size (170 µm).…”