Non-conducting inclusions in a conducting matrix: Influence of inclusion size on electrical conductivity

Weber, Ludger

doi:10.1016/j.actamat.2005.01.004

Cited by 24 publications

(5 citation statements)

References 32 publications

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“…It has been reported by other researchers that the electrical resistivity of composite material is affected by a combination of the following factors [8,[31][32][33][34]: (i) the presence of reinforcement, (ii) the volume fraction of reinforcement, (iii) the reinforcement shape, (iv) the reinforcement size, and (v) the type of reinforcement and matrix.…”

Section: Resultsmentioning

confidence: 98%

Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders

Babaghorbani

Nai

Gupta

2009

Journal of Alloys and Compounds

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Section: Resultsmentioning

confidence: 98%

Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders

Babaghorbani

Nai

Gupta

2009

Journal of Alloys and Compounds

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“…[8]), the total resistivity of a material is the sum of three components: (i) impurity (q i ), (ii) thermal (q t ), and (iii) deformation (q d ) resistivity components. [45,46] q total ¼ q i þ q t þ q d : ½11…”

Section: Resistivity Of the Pure Sn And Sn-zrsio 4 Nanocomposite Cmentioning

confidence: 99%

Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings

Bhattacharya

Sharma

Das

et al. 2016

Metall Mater Trans A

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The Sn-based ZrSiO 4 nanocomposite coatings have been synthesized by pulse co-electrodeposition technique from an aqueous electrolyte containing SnCl 2 AE2H 2 O, C 6 H 17 N 3 O 7 , Triton X, and varying amounts of nano-sized ZrSiO 4 particles (0,5,10,15,20,25,30, and 35 g/L). As-deposited films have been analyzed using X-ray diffraction, scanning electron microscope equipped with an energy dispersive X-ray spectrometer, and transmission electron microscope. The microhardness, wear as well as corrosion property of the coatings have been also evaluated. It is observed that the surface morphology of Sn-ZrSiO 4 nanocomposite coatings is strongly dependent on the reinforcement concentration in the electrolyte, and the Sn-ZrSiO 4 nanocomposite solder deposited from the electrolyte containing 25 g/L ZrSiO 4 yields the highest hardness and the best wear and corrosion property among all the synthesized samples. The whisker growth propensity of the developed Sn-ZrSiO 4 nanocomposites has also been examined after 90 days of aging at room temperature and reported here.

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“…The statistic data of electrical resistivity in Table 2 have clearly revealed that there is only a negligible difference between the plain solder and the FNSs nanoparticles reinforced composite solders. It has been reported by other researchers that the electrical resistivity of a composite material is largely influenced by the type, size, shape, volume fraction of the reinforcements [18][19][20][21]. According to the Matthiessen's rule, the total electrical resistivity of a material is comprised of three parts, namely, the impurity resistivity, the thermal resistivity and the deformation resistivity [22].…”

Section: Resultsmentioning

confidence: 99%

Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder

Chen

Liu

et al. 2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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In this study, fullerene nanoparticles (FNSs, a mixture of approximately 80%C60, 20%C70), by varying their weight fractions (0.05, 0.1 and 0.2wt. %) were successfully added into the SAC305 lead free solder to fabricate composite solders through the powder metallurgy processing route. As well as the retained ratios of fullerene reinforcements in the solder joints were firstly tested, the composite solders were also characterized in terms of their microstructure, melting points, electrical conductivity, wettability and mechanical properties.The retained ratio of FNSs reinforcements in the solder joints shows a considerable decrease with the increase of reflow cycles. After FNSs addition to the solder alloy, the Sn rich phase and IMC phases (Cu 6 Sn 5 and Ag 3 Sn) with a finer microstructure were observed in the solder matrix. With the increasing addition of fullerene, the composite solders showed an improvement in their wetting property but an insignificant change in their melting points and conductivity. The mechanical results indicated that the addition of 0.2wt. % fullerene can lead to 12.1% and 28.2% improvement in micro-hardness and shear strength respectively, when compared with that of the unreinforced solders. Furthermore, the FNSs doped composites exhibited better mechanical performance throughout the 360h aging period.These results obtained from this study proved that the addition of fullerene can improve not only the mechanical properties of the solder alloy, but also the wettability without any notable effect on the melting point and conductivity. Thus, these fullerene doped composite solders can be further developed as a potential material for microelectronics assembly and packaging industry.

show abstract

Non-conducting inclusions in a conducting matrix: Influence of inclusion size on electrical conductivity

Cited by 24 publications

References 32 publications

Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders

Reinforcements at nanometer length scale and the electrical resistivity of lead-free solders

Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings

Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder

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