This paper reports In-doping effects in GaN films grown on Si(111) and α-Al 2 O 3 (0001) substrates using N 2 carrier gas. By using the three step (350 °C, 450 °C and 550 °C) buffer layer growth process, singlecrystalline GaN is obtained on Si(111) as well as on sapphire. From X-ray diffraction and RBS measurements it is revealed that the In incorporation in GaN films grown on Si is about 0.5%, whereas the level in GaN on sapphire is only 0.1%. The crystalline quality and optical properties for In-doped GaN on Si are scarcely improved in spite of the high In content. In-doped samples on Si show a very low excitonic emission peak energy (3.36 eV) because of both InGaN alloy formation and a high tensile stress caused by the hardening effect. In spite of the high tensile stress, the In-doped sample on Si(111) has very few cracks on the surface because of the hardening effect of GaN by In doping.