2018
DOI: 10.1088/1361-6501/aae4c2
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Nondestructive shape process monitoring of three-dimensional, high-aspect-ratio targets using through-focus scanning optical microscopy

Abstract: Low-cost, high-throughput and nondestructive metrology of truly three-dimensional (3-D) targets for process control/monitoring is a critically needed enabling technology for high-volume manufacturing (HVM) of nano/micro technologies in multi-disciplinary areas. In particular, a survey of the typically used metrology tools indicates the lack of a tool that truly satisfies the HVM metrology needs of 3-D targets, such as high aspect ratio (HAR) targets. Using HAR targets here we demonstrate that through-focus sca… Show more

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Cited by 14 publications
(5 citation statements)
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“…93,94 The method has promising application prospects for highaspect-ratio microstructure measurements. 95,96 The measurement method extracts the size information of the structure by matching the optical simulation data library and defocused images captured along the scanning direction. However, the actual measurement environment is susceptible to the interference of noise, the matching degree may be poor, resulting in large measurement errors.…”
Section: Measurements For High-aspect-ratio Microstructuresmentioning
confidence: 99%
See 1 more Smart Citation
“…93,94 The method has promising application prospects for highaspect-ratio microstructure measurements. 95,96 The measurement method extracts the size information of the structure by matching the optical simulation data library and defocused images captured along the scanning direction. However, the actual measurement environment is susceptible to the interference of noise, the matching degree may be poor, resulting in large measurement errors.…”
Section: Measurements For High-aspect-ratio Microstructuresmentioning
confidence: 99%
“…Another nondestructive optical metrology technique, through‐focus scanning optical microscopy, is highly sensitive and suitable for nanostructure measurements 93,94 . The method has promising application prospects for high‐aspect‐ratio microstructure measurements 95,96 . The measurement method extracts the size information of the structure by matching the optical simulation data library and defocused images captured along the scanning direction.…”
Section: Measurements For High‐aspect‐ratio Microstructuresmentioning
confidence: 99%
“…The depths and widths of the microholes affect the groove's filling effect [5], which in turn affects the quality and performance of three-dimensional chip integration. The commonly used micro-hole measurement techniques include coordinate measuring machines [6], length measuring machines [7], and non-contact detection instruments [8][9][10]. The first two methods have high measurement accuracy; however, their disadvantage is that the instrument probe scratches the surface when it contacts the aperture, causing large errors.…”
Section: Introductionmentioning
confidence: 99%
“…To date, various methods have been used to measure the HAR structures of MEMS [9,10]. Scanning electron microscopy (SEM) is a commonly used tool with high resolution and high magnification, but it is costly, inefficient, and not suitable for online real-time detection.…”
Section: Introductionmentioning
confidence: 99%