Novel coated silver (Ag) bonding wire: Bondability and reliability

Kumar, B. Krishna; Murali, Sarangapani; Tae, Kang Il; Evonne, Lim Yee Weon; Wei, Tok Chee; James, K.; Eric, Tan Swee Seng; Xi, Zengzhe

doi:10.1109/eptc.2017.8277574

Search citation statements

Order By: Relevance

Paper Sections

Select...

Original Research Article1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2018

2021

Publication Types

Select...

Other3

Article2

Relationship

Self Cite0

Independent5

Authors

Journals

Cited by 5 publications

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Cu wire is now the state-ofthe-art for wirebonding with about 55 to 60 % of packages are bonded using Cu wires. Silver (Ag) wire bonding on Al on the other hand is currently being developed by the industry to address the economic and technical limitations of Au and Cu wires [3,4]. Al pads are still used in the semiconductor packaging industry due to their cost-effectiveness.…”

Section: Original Research Articlementioning

confidence: 99%

Elimination of Intermetallic Coverage Over-etching on Aluminum Pad

Jaylo-Sia¹,

Pulido²,

Gomez³

2021

JERR

View full text Add to dashboard Cite

Intermetallic coverage (IMC) is one of the critical wirebond output responses that is usually checked to ensure the ball to pad integrity. The success of wirebonding relies on the formation of an interfacial intermetallic growth of ball bond to ensure it can withstand reliability stresses. The challenging approach in IMC analysis detect as over-etching around IMC area that leads to inaccurate IMC data collection. To address the over-etching, we generate a new method which is backside polishing that results to a reliable IMC data collection and help reduced the cycle time of IMC data gathering.

show abstract

Section: Original Research Articlementioning

confidence: 99%