2018
DOI: 10.1002/adfm.201801690
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Novel Electronics for Flexible and Neuromorphic Computing

Abstract: REVIEWbeing converged with artificial intelligence (AI) by providing users' biological and behavioral signals collected in wearable biodevices, [21][22][23][24][25][26][27][28][29][30][31] offering intelligent services based on big data cloud computing and machine learning. [32][33][34][35][36][37][38][39][40] A number of research groups have demonstrated flexible memories, thin film transistors (TFTs), and integrated circuits (ICs) as key technology for data processing, information storage, and communication.… Show more

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Cited by 109 publications
(60 citation statements)
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References 175 publications
(221 reference statements)
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“…The area of flexible electronics is emerging as the base for launching the next generation pervasive electronics due to the ability to implement electronic systems involving electronic circuits, memories, sensors displays, and photovoltaic cells on light weight, conformal and flexible substrates . The capability of bending, folding, twisting, and stretching a substrate with electronics implemented on it, makes it suitable for various types of innovative and novel applications Flexible electronics may be implemented on various types of flexible substrates including plastics, paper, steel, or textiles—out of these, plastics appear to be the more established substrate and commonly used for flexile electronics today. Synthetic plastic such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), and polyimide have been successfully used as substrates for the fabrication of flexible and optoelectronic devices because of their lightweight, flexibility, and good mechanical properties …”
Section: Introductionmentioning
confidence: 99%
“…The area of flexible electronics is emerging as the base for launching the next generation pervasive electronics due to the ability to implement electronic systems involving electronic circuits, memories, sensors displays, and photovoltaic cells on light weight, conformal and flexible substrates . The capability of bending, folding, twisting, and stretching a substrate with electronics implemented on it, makes it suitable for various types of innovative and novel applications Flexible electronics may be implemented on various types of flexible substrates including plastics, paper, steel, or textiles—out of these, plastics appear to be the more established substrate and commonly used for flexile electronics today. Synthetic plastic such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethersulfone (PES), and polyimide have been successfully used as substrates for the fabrication of flexible and optoelectronic devices because of their lightweight, flexibility, and good mechanical properties …”
Section: Introductionmentioning
confidence: 99%
“…In an effort to realize a high‐performance building block for a neuromorphic computing application, many types of two‐ or three‐terminal synaptic devices have been developed, including memristor, phase‐change memory, resistance switching, ferroelectric memory, floating‐gate memory, and field‐effect transistors, by exploiting oxides, organic materials, and inorganic 2D materials . It should be noted that the above devices and the working principles have been reviewed previously and thus will not be introduced in detail here. Instead, we focus on the current efforts based on organic–inorganic hybrid materials.…”
Section: Electronic and Optoelectronic Applicationsmentioning
confidence: 99%
“…Various types of thin‐film µLEDs (e.g., lateral structured µLED, vertical structured µLEDs, and flip chip lateral structured µLED) have been exploited for strategies of enhancing µLED performance . Packaging technology, related to the interconnection of transferred µLEDs to other electronic components and their protection from the external stress, is also crucial for fully functional optoelectronic systems . A number of packaging technologies have been investigated including metal wiring, soldering, flip chip bonding, and anisotropic conductive film (ACF) bonding .…”
Section: Introductionmentioning
confidence: 99%