2015 IEEE International Electron Devices Meeting (IEDM) 2015
DOI: 10.1109/iedm.2015.7409620
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Novel fast-switching and high-data retention phase-change memory based on new Ga-Sb-Ge material

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Cited by 28 publications
(11 citation statements)
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“…Failure rate of GaSbGe-based PCM in a 128 Mb test chip. Only 1% of devices fails after one hour bake at 300 • C (reproduced with permission from [52]). is detrimental for device programming time (> 1µs).…”
Section: B Performance and Reliabilitymentioning
confidence: 99%
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“…Failure rate of GaSbGe-based PCM in a 128 Mb test chip. Only 1% of devices fails after one hour bake at 300 • C (reproduced with permission from [52]). is detrimental for device programming time (> 1µs).…”
Section: B Performance and Reliabilitymentioning
confidence: 99%
“…is detrimental for device programming time (> 1µs). Even if it is the main trend, recent works [52] demonstrated that PCM integrating innovative ternary materials based on GaSbGe alloys can provide high temperature data retention (10 years of retention at 220 • C) still featuring SET time below 100 ns. As reported in Fig.…”
Section: B Performance and Reliabilitymentioning
confidence: 99%
“…19 For Ge-doped GaSb PCM, it has been shown that the devices can still be SET within 100 ns even if T x is high. 33 That is one of the unique characteristics for GaSb based material since it can have high thermal stability without sacrificing speed. The phase segregation observed in this paper could, however, be a key issue for device performance as it can affect crystallization.…”
Section: Ge Doping Level T X ( C)mentioning
confidence: 99%
“…Even so, the cycling endurance in the Ge-doped GaSb devices is guaranteed to up to 1 Â 10 8 . 33 It should actually be pointed out that the experimental conditions (slow ramp rate and long annealing time) for the combined experiment could favor Ge crystallization and phase separation as they correspond to high thermal budget and do not relate to thermal budget involved during the device SET process.…”
Section: Ge Doping Level T X ( C)mentioning
confidence: 99%
“…Phase-Changing RAMs (PCRAMs) [67][68][69][70][71][72], in which a chalcogenide glass can change phase from amorphous to crystalline. Moreover, chalcogenide glass can also hold an intermediate state, allowing for multilevel storage.…”
mentioning
confidence: 99%