Abstract:Multi-RDL architectures in WLP are pushing established materials like polyimide to their limits. Key limitations of these material are high temperature curing and shrinkage which leads to warpage and yield losses. We are developing a dielectric packaging material that has minimal stress upon curing while being compatible with established packaging processes. Another goal is to keep dielectric constant and loss factor as low as possible to ensure compatibility with high frequency applications. Additional featur… Show more
Set email alert for when this publication receives citations?
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.