Multi-RDL architectures in WLP are pushing established materials like polyimide to their limits. Key limitations of these material are high temperature curing and shrinkage which leads to warpage and yield losses. We are developing a dielectric packaging material that has minimal stress upon curing while being compatible with established packaging processes. Another goal is to keep dielectric constant and loss factor as low as possible to ensure compatibility with high frequency applications. Additional feature for this new polymer class is high temperature stability.

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Hybrid Polymers are a material class established in the industry for manufacturing of high-performance optical components, mainly patterned by (nano)imprint processes. Recently, the application range of Hybrid Polymers has been extended into bonding and passivation. In this context, patterning by classical UV-lithography has come into focus as an alternative patterning method to (nano)imprinting. By applying a two-stage curing process with a high intensity, low dose patterning step and a high dose flood exposure after development, it is possible to realize previously unattainable resolutions limits for Hybrid Polymers of 6μm L/S and aspect ratios of more than 3.