International Electron Devices Meeting. Technical Digest
DOI: 10.1109/iedm.1996.553580
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Novel SiGeC channel heterojunction PMOSFET

Abstract: The fabrication and characterization of heterojunction PMOSFETs with strain-engineered Si,~,,Ge,C, channel is reported for the first time. The study has demonstrated the performance enhancement of partially strain compensated Sio,,,,Geo~,C0,, MOSFET over fully-strained metastable Sio,,Geo., channel. Complete strain compensation by incorporating higher amounts of C (Ge-to-C ratio = lO:l), however, results in the degradation of device characteristics as compared to the Si,,Ge, sample.

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Cited by 20 publications
(2 citation statements)
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“…The Si cap layer thickness is 50 Ǻ. Further details on the fabrication process can be found in reference 10 …”
Section: Methodsmentioning
confidence: 99%
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“…The Si cap layer thickness is 50 Ǻ. Further details on the fabrication process can be found in reference 10 …”
Section: Methodsmentioning
confidence: 99%
“…The immediate peaks that are recognized are the phonons peaks of Si, Si-C, SiGe and SiO 2 . FTIR results reveals localized vibrational modes of C in Si at 605 cm -1 (75 mV) and that of Si-C at 800 cm -1 (99.2 mV) 10 .…”
Section: A Phonons and Vibrational Modes Of Inelastic Interactionsmentioning
confidence: 98%