2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) 2007
DOI: 10.1109/vtsa.2007.378901
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Novel SONOS-Type Nonvolatile Memory Device with Suitable Band Offset in HfAlO Charge-Trapping Layer

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“…In order to simultaneously enlarge the memory window, lower the programming/erasing (P/E) voltages, increase the P/E speeds, and improve the charge retention, many dielectrics, e.g. HfO 2 [3], HfLaO x N y [4], HfON [5], TiO 2 [6], HfAlO [7], La 2 O 3 [8] and ZrON [9], have been investigated as CSL to replace Si 3 N 4 in MONOS-type flash memory devices. However, there is no work on Germanium Oxynitride (GeON) as CSL, which has been widely studied as the gate dielectric for Ge MOSFETs due to its higher permittivity, better thermal and chemical stability compared to the native oxide (GeO or GeO 2 ) [10,11].…”
Section: Introductionmentioning
confidence: 99%
“…In order to simultaneously enlarge the memory window, lower the programming/erasing (P/E) voltages, increase the P/E speeds, and improve the charge retention, many dielectrics, e.g. HfO 2 [3], HfLaO x N y [4], HfON [5], TiO 2 [6], HfAlO [7], La 2 O 3 [8] and ZrON [9], have been investigated as CSL to replace Si 3 N 4 in MONOS-type flash memory devices. However, there is no work on Germanium Oxynitride (GeON) as CSL, which has been widely studied as the gate dielectric for Ge MOSFETs due to its higher permittivity, better thermal and chemical stability compared to the native oxide (GeO or GeO 2 ) [10,11].…”
Section: Introductionmentioning
confidence: 99%