Novel structure of ceramic tape for multilayer devices

Structural and Dielectric Properties of Glass – Ceramic Substrate with Varied Sintering Temperatures

“…These forces result in an approach of the ceramic layers towards to each other. Ceramic particles close enough after binder removal between ceramic layers, the particles at the edge can rearrange and move so that the ceramic layers interpenetrate each other and make a homogenous junction due to capillary force resulting in a laminate free of defects [48].…”

Multilayer glass–ceramic composites for microelectronics: processing and properties

“…These forces push the ceramic layers towards each other. If the ceramic particles in different layers are close enough together after the binder has been removed from between the ceramic layers, the particles at the edges can rearrange and move so that the ceramic layers interpenetrate each other and produce a homogeneous junction due to the capillary force, which results in a laminate free of defects (Cho et al , 2009). …”

Ferroelectric and Piezoelectric Properties of Pb(Ni1/3Nb2/3)0.5(Ti0.7Zr0.3)0.5O3Ceramics Fabricated by Tape-Casting Process

“…Stable slurry is composed of ceramic powders dispersed in a solvent which contains dispersant, binder, plasticizer and other surfactants [5][6][7][8]. With simple equipment, stable technology and automated production, tape-casting has been widely used in electronics industry for capacitors, piezoelectric and electrostrictive devices, fuel cells, catalytic substrates, low temperature co-fired ceramic (LTCC) and multilayer ceramic capacitors (MLCCs) [9][10][11][12][13][14][15]. With the development of the electronics industry, the electronic components will become shorter and lighter.…”