Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding

Blanco, F.; Agirregabiria, M.; García, Jorge García; Berganzo, J.; Tijero, M.; Arroyo, María T.; Ruano, Jesus Miguel; Aramburu, I.; Mayora, Kepa

doi:10.1088/0960-1317/14/7/027

Cited by 150 publications

(123 citation statements)

References 24 publications

Supporting

Mentioning

122

Contrasting

Order By: Relevance

“…Photolithography technique was used to define the pattern of the probe, and metallic layers were coated on top of a thick undeveloped SU-8 layer for the first time by a controlled sputtering process. In addition, SU-8 made microchannels were processed on top by thermocompression based on a recipe developed by Ikerlan/IK4 (Blanco et al, 2004;Agirregabiria et al, 2005;Arroyo et al, 2007). Preliminary electrical characterization verified the sensing capability of the probe and biological tests confirmed clean delivery into the brain (Fernández et al, 2009).…”

Section: Viability Study Of Su-8 Microprobes For Neural Applicationsmentioning

confidence: 99%

“…Recently, planar electrodes were integrated at probe surface and signal recording improved significantly (Altuna et al, 2012). Bonding at low temperature and pressure was first suggested as an optimal technique to create embedded microchannels (Blanco et al, 2004;Agirregabiria et al, 2005;Arroyo et al, 2007;Fernández et al, 2009). Now, even lower temperature combined with higher pressure has been used to avoid internal forces and to guarantee probe planarity.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Polymer SU-8-Based Microprobes for Neural Recording and Drug Delivery

2015

View full text Add to dashboard Cite

Citation:Altuna A, Berganzo J and Fernández LJ (2015) Polymer This manuscript makes a reflection about SU-8-based microprobes for neural activity recording and drug delivery. By taking advantage of improvements in microfabrication technologies and using polymer SU-8 as the only structural material, we developed several microprobe prototypes aimed to (a) minimize injury in neural tissue, (b) obtain high-quality electrical signals, and (c) deliver drugs at a micrometer precision scale. Dedicated packaging tools have been developed in parallel to fulfill requirements concerning electric and fluidic connections, size and handling. After these advances have been experimentally proven in brain using in vivo preparation, the technological concepts developed during consecutive prototypes are discussed in-depth now.

show abstract

Section: Viability Study Of Su-8 Microprobes For Neural Applicationsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Polymer SU-8-Based Microprobes for Neural Recording and Drug Delivery

2015

View full text Add to dashboard Cite

show abstract

“…Both thermoplastic polymers, like SU-8 [11] and thermosetting polymers, such as spin-on glass [12], polyimide and DVS-BCB (divinylsiloxane-bis-benzocyclobutene), are used as adhesives [13]. DVS-BCB is a good candidate for hybrid bonding because of its excellent physical properties such as low dielectric constant, low moisture absorption, low curing temperature, high degree of planarization, low level of ionic contaminants, high optical clarity, good thermal stability, excellent chemical resistance, and good compatibility with various metallization systems [13,14].…”

Section: Introductionmentioning

confidence: 99%

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

Keyvaninia¹,

Muneeb²,

Stanković³

et al. 2012

Opt. Mater. Express

161

View full text Add to dashboard Cite

Heterogeneous integration of III-V semiconductor materials on a silicon-on-insulator (SOI) platform has recently emerged as one of the most promising methods for the fabrication of active photonic devices in silicon photonics. For this integration, it is essential to have a reliable and robust bonding procedure, which also provides a uniform and ultra-thin bonding layer for an effective optical coupling between III-V active layers and SOI waveguides. A new process for bonding of III-V dies to processed siliconon-insulator waveguide circuits using divinylsiloxane-bis-benzocyclobutene (DVS-BCB) was developed using a commercial wafer bonder. This "cold bonding" method significantly simplifies the bonding preparation for machine-based bonding both for die and wafer-scale bonding. High-quality bonding, with ultra-thin bonding layers (<50 nm) is demonstrated, which is suitable for the fabrication of heterogeneously integrated photonic devices, specifically hybrid III-V/Si lasers. K. Mayora, "Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding," J. Micromech. Microeng. 14(7), 1047-1056 (2004

show abstract

“…It has been used for hybrid integration of photonic and electronic circuits. 6 Both thermoplastic polymers, like SU-8 7 and thermosetting polymers, such as polyimide and BCB, 8 are used as adhesives. Our heterogeneous integration scheme assumes bonding unprocessed III-V dies on top of pre-patterned SOI waveguide circuits (see Fig.…”

mentioning

confidence: 99%

Die-to-Die Adhesive Bonding Procedure for Evanescently-Coupled Photonic Devices

Stanković

Jones

Heck

et al. 2011

Electrochem. Solid-State Lett.

View full text Add to dashboard Cite

Recently demonstrated evanescent hybrid III-V/Si lasers are mostly based on molecular bonding of a III-V die on an SOI photonic wafer. This procedure requires ultra-clean and smooth bonding surfaces and might be difficult to implement in an industry-scale fabrication process. As an alternative, we present a die-to-die adhesive bonding procedure, using a DVS-BCB polymer. We achieved less than 100 nm-thick bonding layers that enable evanescent coupling between III-V and silicon. The process shows good robustness and bonding strength, with a break-down shear stress of 2 MPa. The process can be scaled-up to a multiple die-towafer bonding procedure. Silicon photonics, based on the silicon-on-insulator (SOI) material platform, is considered as the technology of choice for the integration of photonic devices with microelectronic circuits. However, the fabrication of efficient light sources in silicon photonics is challenging due to silicon's indirect bandgap. Heterogeneous integration, achieved through the bonding of III-V semiconductor materials on a SOI platform, is the most promising approach to address this problem. Among several schemes to couple the light from the III-V active medium into the SOI waveguide, 1 evanescent optical coupling is the most promising one and requires no additional coupling structures, 2 although the active material and the silicon waveguide need to be within several hundred nanometers. Several evanescent hybrid III-V/ Si lasers based on direct bonding were reported, 2-5 but this technique is very sensitive to surface topography, contamination or presence of particles and may not be sufficiently robust for industrial-scale fabrication where such strict requirements are difficult to meet.Compared to direct bonding, adhesive bonding is more tolerant to surface topography and particle contamination. It has been used for hybrid integration of photonic and electronic circuits.6 Both thermoplastic polymers, like SU-8 7 and thermosetting polymers, such as polyimide and BCB, 8 are used as adhesives. Our heterogeneous integration scheme assumes bonding unprocessed III-V dies on top of pre-patterned SOI waveguide circuits (see Fig. 1a). Precise bonding alignment is not required since the III-V dies are processed after the bonding. Post-bonding thermal budget should allow 350 C processing of the III-V components. Therefore, a thermosetting polymer, divinylsiloxane-bis-benzocyclobutene (DVS-BCB), also referred to as BCB, was chosen. It is a well-known material that is used both for wafer-to-wafer 8 and die-to-wafer bonding processes. 9 Recently, the fabrication of evanescently-coupled photodetectors, 10 hybrid III-V/Si lasers 11 and several other photonics devices 12 using BCB bonding has been demonstrated, but in these cases, a manual bonding procedure was used. This resulted in a difficult-to-control bonding procedure, which prevents scaling-up to an industrial-level fabrication. In this paper, we report a machine-based BCB bonding process providing thin bonding layers (<100 nm), suitable for the fa...

show abstract

Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding

Cited by 150 publications

References 24 publications

Polymer SU-8-Based Microprobes for Neural Recording and Drug Delivery

Polymer SU-8-Based Microprobes for Neural Recording and Drug Delivery

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

Die-to-Die Adhesive Bonding Procedure for Evanescently-Coupled Photonic Devices

Contact Info

Product

Resources

About