Novel transient liquid phase bonding through capillary action for high-temperature power devices packaging

Shao, Huili; Wu, Aiping; Bao, Yudian; Zhao, Yue; Zou, Guisheng; Liu, Lei

doi:10.1016/j.msea.2018.03.097

Cited by 36 publications

(10 citation statements)

References 20 publications

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“…Filler infiltration into graphite open pores occurs due to the high‐temperature capillary action of liquid filler. Infiltration can contribute to not only the densification of graphite substrate but also reduction in defects . Meanwhile, the infiltration may increase the bonding area between the filler and graphite substrate to promote a mechanical lock, beneficial for the improvement of the joint mechanical properties.…”

Section: Resultsmentioning

confidence: 99%

Joining of Graphite to Ti6Al4V Alloy Using Cu‐Based Fillers

Duan

Mao

et al. 2019

Adv Eng Mater

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Joining of graphite to Ti6Al4V (TC4) alloy is achieved with three Cu-based fillers (Cu-22TiH 2 , Cu-50TiH 2 , and Cu-30TiH 2 -5Ni). Microstructural characterizations reveal that a thin TiC layer and a diffusion layer containing Ti solid solution (Ti(ss)) with Ti 2 Cu are developed at the graphite/filler layer and filler layer/TC4 interfaces, respectively. For the joint obtained with Cu-22TiH 2 filler, the filler layer consists of TiCu and Ti 2 Cu, whereas it is composed of Ti 2 Cu, TiCu, and Ti(ss) for the joint with Cu-50TiH 2 filler. In the case of the joint with Cu-30TiH 2 -5Ni filler, the filler layer mainly contains Ti(Cu,Ni) and Ti 2 (Cu,Ni). The microhardness of the interfacial area in the joints is highly related to the microstructure of joints. The filler layer of the joint with Cu-50TiH 2 filler exhibits higher microhardness than those with Cu-22TiH 2 and Cu-30TiH 2 -5Ni fillers, owing to the high content of Ti 2 Cu phase with relatively high microhardness and the increase in hardness of Ti-Cu intermetallics at higher brazing temperatures. The high shear strength of joints reveals favorable bonding of Cu-based fillers with substrates.

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Section: Resultsmentioning

confidence: 99%

Joining of Graphite to Ti6Al4V Alloy Using Cu‐Based Fillers

Duan

Mao

et al. 2019

Adv Eng Mater

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“…Shao et al [70] studied TLP through capillary action for high-density power device packaging using hybrid solder consisting of a layer of Cu powders and Sn foils. They reported high heat-resistant joints characteristic of Cu-Sn IMCs and dispersed Cu particles, even at a temperature of 250 • C within 20 min.…”

Section: Foil Type Interlayersmentioning

confidence: 99%

“…and lead-free epoxy composite solder [77]. Ternary sandwiched structures have also been used, e.g., Cu/Sn/Cu and Ni/Sn/Ni joint, by Chu et al [70], Ag/Sn/Ag system, by Li et al [91], and Cu bump/Sn/Cu bump, by Deng et al [92]. The addition of CNTs has yielded attractive bonding properties [93].…”

Section: Composite Fillersmentioning

confidence: 99%

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Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

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Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

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“…During the joining process, as the temperature reaches 232°C, Sn coated on the Cu-MWCNT melts and reacts with copper to form Cu-Sn IMC. At the interface of Sn and Cu-MWCNT, Cu3Sn forms according to Equation (2), whereas in Sn rich regions (surface of Figure 5b [7,9,10,[25][26][27][28][29][30][31][32]. Microstructural aspects such as the type and dispersion of second phase particles play an important role in the mechanical property of the joint.…”

Section: Appl Sci 2019 9 X For Peer Review 6 Of 10mentioning

confidence: 99%

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

et al. 2019

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In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future.

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Novel transient liquid phase bonding through capillary action for high-temperature power devices packaging

Cited by 36 publications

References 20 publications

Joining of Graphite to Ti6Al4V Alloy Using Cu‐Based Fillers

Joining of Graphite to Ti6Al4V Alloy Using Cu‐Based Fillers

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics

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