2015
DOI: 10.1103/physrevb.91.064421
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Nuclear magnetic resonance study of thinCo2FeAl0.5Si0.5Heusler films with varying thickness

Abstract: Type, degree and evolution of structural order are important aspects for understanding and controlling the properties of highly spin polarized Heusler compounds, in particular with respect to the optimal film growth procedure. In this work, we compare the structural order and the local magnetic properties revealed by nuclear magnetic resonance (NMR) spectroscopy with the macroscopic properties of thin Co 2 FeAl 0.5 Si 0.5 Heusler films with varying thickness. A detailed analysis of the measured NMR spectra pre… Show more

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Cited by 9 publications
(5 citation statements)
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“…This mechanism has been verified by the epitaxial growths of a diverse set of materials, including Heusler alloys [169][170][171], FeGe [132], Co 25 Fe 75 [50], double perovskites [167,[171][172][173][174][175][176][177][178][179][180][181][182][183][184], and YIG [48,[113][114][115][116][117][118][119][120][121][122][123][124][125][126][127][128][129][130][131][133][134][135][136]. The deposition conditions for most materials are as follows: (1) sputtering gases: ultrahigh purity argon, plus 0% to 5% oxygen for oxides depending on the reduction-oxidation chemistry of the mat erials; (2) substrate location: off-axis angle 50° < β < 60°, substrate-to-target distance: 3.5″-4″; (3) substrate temper ature: 200°C-850°C depending on the materials; and (4) deposition rates: 5-120 nm h −1 depending on the materials and sputtering power, which is comparable to the deposition rates of...…”
Section: Uhv Off-axis Magnetron Sputteringmentioning
confidence: 77%
See 2 more Smart Citations
“…This mechanism has been verified by the epitaxial growths of a diverse set of materials, including Heusler alloys [169][170][171], FeGe [132], Co 25 Fe 75 [50], double perovskites [167,[171][172][173][174][175][176][177][178][179][180][181][182][183][184], and YIG [48,[113][114][115][116][117][118][119][120][121][122][123][124][125][126][127][128][129][130][131][133][134][135][136]. The deposition conditions for most materials are as follows: (1) sputtering gases: ultrahigh purity argon, plus 0% to 5% oxygen for oxides depending on the reduction-oxidation chemistry of the mat erials; (2) substrate location: off-axis angle 50° < β < 60°, substrate-to-target distance: 3.5″-4″; (3) substrate temper ature: 200°C-850°C depending on the materials; and (4) deposition rates: 5-120 nm h −1 depending on the materials and sputtering power, which is comparable to the deposition rates of...…”
Section: Uhv Off-axis Magnetron Sputteringmentioning
confidence: 77%
“…To simultaneously address the problems of energetic bombardment and off-stoichiometry associated with conventional on-axis and high pressure off-axis sputtering, we developed a new off-axis sputtering technique in the past several years [168]. Using this new technique, we have successfully grown single-crystalline epitaxial films of a broad range of complex materials with a high degree of structural perfection and stoichiometric compositions, including Heusler compounds [169][170][171], B20-phase FeGe [132], Co 25 Fe 75 [50], double perovskites [167,[171][172][173][174][175][176][177][178][179][180][181][182][183][184], and YIG [48,[113][114][115][116][117][118][119][120][121][122][123][124][125][126][127][128][129][130][131][133][134][135][136]. Below we discuss the details of our off...…”
Section: Uhv Off-axis Magnetron Sputteringmentioning
confidence: 99%
See 1 more Smart Citation
“…Epitaxial 84 nm Co 2 FeAl 0.5 Si 0.5 film was grown on MgAl 2 O 4 (001) substrate by off-axis sputtering in a UHV system with a base pressure as low as 9.5•10 −11 mbar using ultra-pure Ar (99.9999%) as sputtering gas. Optimal quality Co 2 FeAl 0.5 Si 0.5 epitaxial film was obtained at an Ar pressure of 6•10 −3 mbar, a substrate temperature of 600 • C, and DC sputtering at a constant current of 12 mA, which results in a deposition rate of 5.6 Å/min [14,15].…”
Section: Investigated Samplesmentioning
confidence: 99%
“…• C, and DC sputtering at a constant current of 12 mA, which results in a deposition rate of 5.6Å/min [14,15].…”
Section: Investigated Samplesmentioning
confidence: 99%