Numerical Analysis of Heat Transfer and Fluid Flow in Mini-channel Heat Sink with Interconnecting Channels

Singh, Vasujeet; Das, Harish Chandra; Nemalipuri, Pruthiviraj

doi:10.1007/978-981-15-0124-1_88

Cited by 2 publications

(1 citation statement)

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“…The design, fabrication prototype, and ZANCO Journal of Pure and Applied Sciences 2020 development of an experimental test bench were applied for thermal performance characterization, experimental results show highest temperature reduction for the gate drive IC devices in a laboratory environment. (Singh et al, 2020) proposed three individual mini-channels with differently configured interconnecting secondary channels heatsink geometry, based on finite volume method, they solved mathematical model in ANSYS to study the issue numerically. The results findings proved that, lowest base plate temperature of mini-channel heatsink is noticed at 10° secondary channel angle, and performance of electronic device will be analyzed at 10° secondary channel angle.…”

Section: Introductionmentioning

confidence: 99%

Power and Thermal Management Issues for Portable Processors

2020

ZJPAS

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The advancement of modern CMOS technology scaling causes an exponential rise of system's power dissipation and temperatures in submicron technology node, which growth production and operating costs. Thermal energy and generated heat are becoming a prominent major issue in the context of portable applications (telephony, PDAs, digital cameras ...) and must be considered at each design level. The performance of portable processors is critically affected by dissipated power and operational temperature. The designers are forced to design a proper cooling system, especially heatsinks which consistently allows a low power and low temperature regulation of high-speed processors. In this article, several different heatsinks are modeled, tested, and designed to optimize the microprocessor's cooling system while ensuring proper thermal operation and lowest power dissipation. The proposed adopted heatsink and their selected design configurable parameters are analyzed theoretically for different validations conditions and operation modes in various real-time thermal conditions. Thermal Analysis Package is used for simulation the proposed heatsinks model. Results shows the specification improvements of the design model for ensuring power required to cool in time of 0.851 W, time to cool by 15s, and heat to remove is 12.77J which confirms theoretical fundamentals and sufficient improvement of temperature minimization and better performance of the cooling system was achieved.

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Section: Introductionmentioning

confidence: 99%