2007 IEEE International Electron Devices Meeting 2007
DOI: 10.1109/iedm.2007.4419092
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Observation of Mobility Enhancement in Strained Si and SiGe Tri-Gate MOSFETs with Multi-Nanowire Channels Trimmed by Hydrogen Thermal Etching

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Cited by 32 publications
(25 citation statements)
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“…Thus, strain engineering is used to enhance the performance of both n-channel MOS and p-channel MOS devices in modern CMOS nodes below 90 nm [14], [15]. For planar devices and SOI, there has been extensive research on the effects of strain as a performance booster [16]- [19], and recently, this interest has extended to silicon nanowires [12], [20]. Uniaxial compressive strain is found to enhance performance in silicon nanowire pMOSFETs in [21], whereas uniaxial tensile strain enhancement is used as a booster for tri-gate nMOSFETs [22].…”
Section: Strain As Booster Of Carrier Mobilitymentioning
confidence: 99%
“…Thus, strain engineering is used to enhance the performance of both n-channel MOS and p-channel MOS devices in modern CMOS nodes below 90 nm [14], [15]. For planar devices and SOI, there has been extensive research on the effects of strain as a performance booster [16]- [19], and recently, this interest has extended to silicon nanowires [12], [20]. Uniaxial compressive strain is found to enhance performance in silicon nanowire pMOSFETs in [21], whereas uniaxial tensile strain enhancement is used as a booster for tri-gate nMOSFETs [22].…”
Section: Strain As Booster Of Carrier Mobilitymentioning
confidence: 99%
“…However, experimental NWs are frequently doped and the mobility can strongly be reduced due to scattering on ionized impurities. The large experimental mobilities for 110 SiNWs with d NW >10 nm, on the other hand, can be explained by strain effects [32], [39], [45], [46], which have not been accounted for in our model. Nevertheless, the model in its present form can be used as a reference for benchmarking SiNW technologies.…”
Section: Low-field Mobility Modelmentioning
confidence: 85%
“…In terms of sub-12 nm FETs, recent studies have ranged from carbon nanotube to graphene devices, 9 nanowire Si and SiGe FETs, 10 and Ge 11 and InGaAs FETs. 12 Si/SiGe double quantum dot structures, laterally coupled by use of Coulomb blockade barriers involving spin-based quantum computing, have also been reported.…”
Section: Scaling Of Sws-qdc-fets To 9 Nm and Integration With Cmos Bimentioning
confidence: 99%
“…This enables processing of two or more bits simultaneously. [1][2][3] In a two-quantum-well system, state (00) is represented by no electrons, or their wavefunctions, located in either well; state (01) is represented by electrons in well W2; state (11) is represented by electrons in both wells, W2 and W1; and state (10) is represented by electrons in well W1. The assignment of states can be changed, depending on the application.…”
Section: Introductionmentioning
confidence: 99%