Oligosilylarylnitrile: The Thermoresistant Thermosetting Resin with High Comprehensive Properties

Wang, Mingcun; Yi, Ning

doi:10.1021/acsami.8b00238

Cited by 50 publications

(28 citation statements)

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In this study, we extend the previous study to investigate the rheological properties [10][11][12][13][14][15][16][17][18][19][20] of the reworkable resins.…”

Section: Introductionmentioning

confidence: 68%

Rheological Studies of Reworkable Photocuring Resins

Okamura

Tachi

2018

J. Photopol. Sci. Technol.

View full text Add to dashboard Cite

Rheological studies of reworkable photocuring resins were carried out using reworkable monomers. A dimethacrylate monomer containing tertiary ester units in a molecule and a methacrylate monomer, which has both an epoxy moiety and a thermally-cleavable tertiary ester moiety in a molecule, were employed as the reworkable monomers. When the cured reworkable monomers were irradiated and baked in the presence of a photoacid generator, the storage moduli of the cured resin decreased at elevated temperatures. The decreased storage moduli revealed by the rheological studies were due to the acid-catalyzed decomposition of the tertiary ester linkages in the cured reworkable monomers.

show abstract

“…In this study, we extend the previous study to investigate the rheological properties [10][11][12][13][14][15][16][17][18][19][20] of the reworkable resins.…”

Section: Introductionmentioning

confidence: 68%

Rheological Studies of Reworkable Photocuring Resins

Okamura

Tachi

2018

J. Photopol. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…For thermosetting resins, epoxy resins, phenol resins, and unsaturated polyester resins are the most common, and what the materials have in common is their infusible and insoluble properties, which makes the materials difficult to recycle. [ 4–7 ] Therefore, the development of bio‐based thermosetting resins is of far‐reaching significance. [ 8,9 ]…”

Section: Introductionmentioning

confidence: 99%

Bio‐based hydroxymethylated eugenol modified bismaleimide resin and its high‐temperature composites

Wang

et al. 2020

J of Applied Polymer Sci

Self Cite

View full text Add to dashboard Cite

Hydroxymethylated eugenol (MEG) and poly (hydroxymethylated eugenol) (PMEG) were synthesized by the condensation reaction of eugenol (EG) with formaldehyde. The different contents of MEG and PMEG were used to modify 4,4 0-bismaleimidediphenylmethane (BMI). The cured MEG-BMI resins exhibit good thermal stability evidenced by its 5% weight loss temperatures above 407 C and its residue above 39.4% at 800 C under nitrogen. For carbon/MEG-BMI composites, their glass transition temperatures were around 400 C; their flexural strength and moduli were maintained at a range of 488.87-575.47 MPa and 48.84-60.26 GPa, respectively. With the increasing content of BMI in the resin formulation, the flexural properties decreased; comprehensively the composite with the eugenol/maleimide unit ratio (1:0.3 mol) had the best mechanical and thermal properties, meanwhile its renewable carbon content was as high as 57.80%. As a new candidate of high temperature thermosetting resin, MEG would find promising applications for advanced composites' matrice.

show abstract

“…Wang and Ning synthesized a type of oligosilylarylnitrile by lithium-reduced Wurtz–Fittig condensation. 16 The introduction of silyl units provided the oligomer with not only good processability but also excellent comprehensive properties. However, the harsh reaction conditions and low yield limit its potential application.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and properties of a novel silicon-containing phthalonitrile resin and its quartz-fiber-reinforced composites

Deng

et al. 2020

High Performance Polymers

View full text Add to dashboard Cite

A novel silicon-containing phthalonitrile monomer named bis(4-(4′-(4′-phenoxy)phenyl)phenyl)dimethylsilane phthalonitrile (SiBPPN) was successfully designed and synthesized. The chemical structure was characterized by proton nuclear magnetic resonance and Fourier transform infrared (FTIR) analyses, and its molecular weight was determined by mass spectrometry. Its melting point is lower than that of 4,4′-bis(3,4-dicyanophenoxy)biphenyl (BPPN), which has no silicon atom, and its solubility is also much better than that of BPPN. The curing behavior of SiBPPN was studied by differential scanning calorimetry and FTIR analyses in detail. The thermal and thermomechanical properties of the polymer and laminate were studied by thermogravimetric analysis and dynamic mechanical analysis. The results show that the cured SiBPPN (c-SiBPPN) possesses excellent thermal and mechanical properties. Under nitrogen atmosphere, its residual weight ratio at 800°C is 81.5% and the 5% thermal degradation temperature is 546°C. In addition, quartz-fiber (QF)-reinforced c-SiBPPN composites exhibit mechanical properties superior to those of QF-reinforced cured BPPN composites. The interlaminar shear strength and bending strength of the composite are 30.44 and 389 MPa at room temperature, and the interlaminar shear strength and bending strength of the composite are 22.25 and 339 MPa at 300°C.

show abstract

Oligosilylarylnitrile: The Thermoresistant Thermosetting Resin with High Comprehensive Properties

Cited by 50 publications

References 41 publications

Rheological Studies of Reworkable Photocuring Resins

Rheological Studies of Reworkable Photocuring Resins

Bio‐based hydroxymethylated eugenol modified bismaleimide resin and its high‐temperature composites

Synthesis and properties of a novel silicon-containing phthalonitrile resin and its quartz-fiber-reinforced composites

Contact Info

Product

Resources

About