Sputtering process for the voidless boundary growth (columnless microstructure) of Co-Cr thin films was discussed from the point of some experimental results on heat flux characteristics of facing targets sputtering (FrS) method in comparison with planar magnetron sputtering (PMS) method. It is safe to conclude that high heat exchange-energy (heat flux) of adatoms (e.g. more than 1 W/cm 2 at 1J.1rn/min deposition rate) and less impingement of abnormal energetic panicles into the coating layers (plasma free condition) are mainly essential for the suppression process of voided microstructures such as columnar growth of Co-Cr thin films.