On-die diffractive alignment structures for packaging of microlens arrays with 2-D optoelectronic device arrays

Boisset, G.C.; Robertson, Brian; Hsiao, Wei-Ta; Taghizadeh, M. R.; Simmons, J.G.; Song, Kai; Matin, M. A.; Thompson, David A.; Plant, David V.

doi:10.1109/68.502270

Cited by 21 publications

(5 citation statements)

References 8 publications

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“…For this reason, several different passive alignment schemes were investigated; in all cases, the cumulative dicing, machining and locational tolerances exceeded the allowed misalignment (as specified in the second column of table 1), indicating the need for an alternative alignment technique in this case. Active alignment schemes suitable to our application have been demonstrated in the past (see, for example, [6]). Although these packaging techniques were used successfully to produce high-performance optical subassemblies, they are labour intensive and generally require a high level of operator skill.…”

Section: Optomechanical Design and Characterizationmentioning

confidence: 99%

Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Ayliffe¹,

Kabal²,

Lacroix³

et al. 1999

J. Opt. A: Pure Appl. Opt.

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Innovative approaches to the design of a high-performance package module accommodating a 32 × 32 array of surface-active devices indium bump bonded to a 8 × 8 mm 2 VLSI chip are presented. Electrical, thermal and optomechanical design considerations are discussed and experimental performance results of a prototype implementation are described. The package module supports 139 impedance-controlled signal connections as well as active temperature stabilization of the optoelectronic VLSI chip. The package module is compact, simple to assemble, alignment-tolerant and can be passively inserted into a free-space optical system with no need for further adjustments.

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Section: Optomechanical Design and Characterizationmentioning

confidence: 99%

Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Ayliffe¹,

Kabal²,

Lacroix³

et al. 1999

J. Opt. A: Pure Appl. Opt.

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“…I will primarily concentrate on the design, fabrication and applications of surface relief structures as well as refractive microlens arrays for use in a number of interconnection and switching systems. In addition, the role and advantages offered by diffractive microstructures in precise alignment of opto-electronics device arrays with micro-optical components, that are required for beam shaping in system applications, will be discussed [2][3][4].…”

mentioning

confidence: 99%

<title>Micro-optical fabrication technologies for optical interconnection applications</title>

Taghizadeh¹

2000

SPIE Proceedings

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“…This was demonstrated with microlenses etched directly upon a laser substrate 2 or formed upon a separate substrate aligned with the OE chip. 3,4 In general these optical input-output signal paths are different, which implies that the optics must provide dual functionality when one is implementing the communication links. Since conventional diffractive optical elements or micro-optics components do not have this dual functionality, additional components such as polarization beam splitters are required for separating the input and the output signals.…”

mentioning

confidence: 99%

Optoelectronic-VLSI packaging with polarization-selective computer-generated holograms

Fainman

Ford³

et al. 1997

Opt. Lett.

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We present what is believed to be the first packaged module incorporating polarization-based beam-forming optics integrated with an optoelectronic-VLSI device. The chip has multiple quantum-well modulators and detectors that are flip-chip bonded onto a silicon CMOS integrated circuit. In the assembled module a polarization-selective computer-generated hologram converts linearly polarized light into a two-dimensional spot array to illuminate the output modulators. The lenslets do not interfere with the input data or the reflected output, which is orthogonally polarized. We demonstrate a 9x10 modulator array, showing good spot-intensity uniformity and registration with modulators.

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On-die diffractive alignment structures for packaging of microlens arrays with 2-D optoelectronic device arrays

Cited by 21 publications

References 8 publications

Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

<title>Micro-optical fabrication technologies for optical interconnection applications</title>

Optoelectronic-VLSI packaging with polarization-selective computer-generated holograms

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