On hillocks generated during anisotropic etching of Si in TMAH

Landsberger, L. M.; Naseh, Sasan; Kahrizi, Mojtaba; Paranjape, Makarand

doi:10.1109/84.506198

Cited by 100 publications

(81 citation statements)

References 27 publications

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“…The results are consistent with etching that proceeds in the Si <110> direction, bounded by (111) planes. By consequence, an undercut process that begins at the RIE trenches leaves {111} silicon pyramids positioned at the centers of the device blocks (39). Fig.…”

Section: Resultsmentioning

confidence: 99%

Materials and processing approaches for foundry-compatible transient electronics

Chang

Fang

Bower³

et al. 2017

Proc. Natl. Acad. Sci. U.S.A.

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Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for "green" electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-theart silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.soft electronics | biodegradable electronics | transfer printing | undercut etching | hydrolysis S emiconductor technology is increasingly essential to nearly all aspects of modern society, with projections of market sizes that will exceed $7 trillion in 2017, equivalent to 10% of the world's gross domestic product (1-4). The rapid and accelerating pace of innovation in this area leads to increases in the frequency with which consumers upgrade their devices, thereby contributing to the production of >50 million tons of electronic waste (e-waste) each year (5, 6). Furthermore, the anticipated emergence of electronics for internet-of-things applications, along with the continued proliferation of radio frequency (RF) identification tags and other high-volume electronic goods, create daunting challenges with the management of this e-waste (7, 8). These considerations motivate research into forms of electronics that can degrade naturally into the environment to harmless end products. Such technology is also of interest for other, unique classes of applications, ranging from biodegradable, temporary electronic implants to hardware secure data systems and unrecoverable, field-deployed devices (9-12). Sometimes referred to collectively as transient electronics, these types of devices can be constructed by using designer materials, such as specially formulated polymers or natural products (13-16), or clever combinations of established materials, well-aligned to existing ...

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Section: Resultsmentioning

confidence: 99%

Materials and processing approaches for foundry-compatible transient electronics

Chang

Fang

Bower³

et al. 2017

Proc. Natl. Acad. Sci. U.S.A.

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“…The steady-state surface condition must take into account the rates of birth, growth and death of pyramids and several models describing the genesis and the time evolution of pyramidal hillocks have been recently developed [2,[44][45][46]. In addition, Monte-Carlo simulations have been successfully used to model structure formation and mask under-etching in micromachining [47].…”

Section: Estimation Of the Steady-state Height Of Micro-pyramidsmentioning

confidence: 99%

Surface termination and hydrogen bubble adhesion on Si(100) surfaces during anisotropic dissolution in aqueous KOH

Haiss

Raisch

Bitsch

et al. 2006

Journal of Electroanalytical Chemistry

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The formation and growth of hydrogen bubbles on a Si(1 0 0) surface during its anisotropic etching in aqueous KOH has been investigated. Quantitative data on bubble size, lifetime and density on the etching surface was obtained and their dependence on KOH concentration, applied potential and temperature were measured. In situ FTIR measurements demonstrated a strong dependence of bubble attachment on surface termination and hence on the hydrophilicity of the Si(1 0 0) surface during etching. The formation of surface defects and the geometry of bubble imprints have been directly characterised with scanning probe microscopy. The analysis of hillock formation and statistical considerations show that the adhesion of hydrogen bubbles during anisotropic etching of silicon is a source of surface roughness and pyramid formation.

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“…More details about the fabrication process of the textured Si surfaces can be found elsewhere. [34][35][36][37][38][39][40][41][42] 043502-2 Mehrabian et al…”

Section: Modelmentioning

confidence: 99%

The effect of microscopic texture on the direct plasma surface passivation of Si solar cells

Mehrabian

Qaemi

et al. 2013

Physics of Plasmas

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The effect of microscopic texture on the direct plasma surface passivation of Si solar cells AbstractTextured silicon surfaces are widely used in manufacturing of solar cells due to increasing the light absorption probability and also the antireflection properties. However, these Si surfaces have a high density of surface defects that need to be passivated. In this study, the effect of the microscopic surface texture on the plasma surface passivation of solar cells is investigated. The movement of 105Hþ ions in the texture-modified plasma sheath is studied by Monte Carlo numerical simulation. The hydrogen ions are driven by the combined electric field of the plasma sheath and the textured surface. The ion dynamics is simulated, and the relative ion distribution over the textured substrate is presented. This distribution can be used to interpret the quality of the Si dangling bonds saturation and consequently, the direct plasma surface passivation. Textured silicon surfaces are widely used in manufacturing of solar cells due to increasing the light absorption probability and also the antireflection properties. However, these Si surfaces have a high density of surface defects that need to be passivated. In this study, the effect of the microscopic surface texture on the plasma surface passivation of solar cells is investigated. The movement of 10 5 H þ ions in the texture-modified plasma sheath is studied by Monte Carlo numerical simulation. The hydrogen ions are driven by the combined electric field of the plasma sheath and the textured surface. The ion dynamics is simulated, and the relative ion distribution over the textured substrate is presented. This distribution can be used to interpret the quality of the Si dangling bonds saturation and consequently, the direct plasma surface passivation. V C 2013 American Institute of Physics. [http://dx

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On hillocks generated during anisotropic etching of Si in TMAH

Cited by 100 publications

References 27 publications

Materials and processing approaches for foundry-compatible transient electronics

Materials and processing approaches for foundry-compatible transient electronics

Surface termination and hydrogen bubble adhesion on Si(100) surfaces during anisotropic dissolution in aqueous KOH

The effect of microscopic texture on the direct plasma surface passivation of Si solar cells

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