The mechanism of growth of an epitaxial Si 0.5 Ge 0.5 layer on a single crystalline (sc) Si (100) substrate by aluminum-induced solid phase epitaxy (AI-SPE) at a relatively low temperature (450 °C) has been revealed using in situ heating transmission electron microscopy (TEM). The analysis of the thermodynamics exactly supports the finding from in situ TEM. It evidences that the Si 0.5 Ge 0.5 prefers to nucleate at the interface of the Al layer and the sc-Si (100) substrate due to the lowest critical thickness for nucleation. Based on the results from in situ TEM and thermodynamic analysis, the germanium (Ge) virtual substrate of the compositional gradient can be successfully prepared via a multi-run AI-SPE process at low-temperature.Hetero-epitaxial growth of a Si 1−x Ge x thin film on single crystal (sc) Si (100) has been extensively studied in the past decades due to its possible applications in high speed MOS devices. 1,2 In addition, the epitaxial silicon-germanium (epi-SiGe) film can serve as a template for high-performance multi-junction solar cells due to a tunable energy band gap that is a function of the Ge fraction. [3][4][5] Conventionally, the epi-SiGe film can be grown using chemical vapor deposition (CVD), 6 or molecular beam epitaxy (MBE); 7 however, these techniques usually require strict conditions of high vacuum, high temperature, and use of toxic precursors. It was reported that the epi-SiGe film can be fabricated using an Al solid phase epitaxial (AI-SPE) process from a-Ge/Al layers on a Si substrate after annealing at 300 °C. 8-10 However, the molar fraction of Ge in these cases cannot be accurately tuned due to the fact that the Si in the epi-SiGe film completely comes from a Si substrate. Therefore, growth of compositional gradi-ent epi-SiGe films is very difficult to achieve. A Ge composition-controllable process for epi-SiGe films grown from an amorphous Si 1−x Ge x (a-Si 1−x Ge x )/Al/sc-Si (100) substrate system has been demonstrated in our previous paper. 11 However, the mechanism has not yet been understood and investigated. It was reported that, in the amorphous Si (a-Si) (or amorphous Ge; a-Ge)/Al/glass case, the covalent bonds of the interfacial a-Si (or a-Ge) atoms are weakened and become relatively "free" due to the screening effect arising from the extra electrons offered by the metal. [12][13][14] The diffusion behaviour of a "free" atom plays a critical role in the metal-induced crystallization reaction. 15,16 In the metal-induced process, as shown in Fig. 1(a)-(c), the nuclei have a chance to form at three different positions: Al grain boundaries (GB-mediated mechanism), interface of Al/a-Si 1−x Ge x , (top-interface (TI)-mediated mechanism) and interface of Al/sc-Si (100) substrate (bottominterface (BI)-mediated mechanism). These three positions are denoted as positions 1, 2, and 3, respectively. It was 3556