On the Thermal Management Challenges in Next Generation Handheld Devices

Wagner, Guy; Maltz, William

doi:10.1115/ipack2013-73237

Cited by 8 publications

(2 citation statements)

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“…Under this condition, the maximum heat transfer was recalculated as the heat transfer of the FMHP that occurred at the maximum allowable temperature. In this paper, we define the allowable maximum temperature limit to be 80 °C because the performance of electronic components in mobile devices can be dramatically decreased above 80 °C [27,28].…”

Section: Theoretical Approach For Maximum Heat Transfer Rate Of Fmhpsmentioning

confidence: 99%

Effect of mesh wick geometry on the maximum heat transfer rate of flat-micro heat pipes with multi-heat sources and sinks

Subedi

Kim

Jang

et al. 2019

International Journal of Heat and Mass Transfer

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This paper presents a theoretical investigation of the thermal characteristics of flat-micro heat pipes (FMHPs) with multi-heat sources and sinks. Analytical solutions of the pressure and the temperature distributions of FMHPs with multi-heat sources and sinks were obtained based on the modified liquid pressure drop. The solutions were used to identify the key engineering parameters of a mesh wick with microscale length that affect the maximum heat transfer rate of the FMHPs with multi-heat sources and sinks. The effects of the key engineering parameters on the maximum heat transfer rate of the FMHPs were presented for two limits. The first limit is the capillary limit and the other is the allowable maximum temperature limit which is used to ensure that the maximum surface temperature of the FMHP with the maximum heat transfer rate calculated at the capillary limit does not exceed the allowable maximum temperature of the electronic components. Finally, the theoretically results for the optimized wick structure for the corresponding maximum heat transfer rate and the surface temperature distribution of the FMHP were compared for the capillary limit only and for the maximum temperature limit cases, respectively.

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Section: Theoretical Approach For Maximum Heat Transfer Rate Of Fmhpsmentioning

confidence: 99%

Effect of mesh wick geometry on the maximum heat transfer rate of flat-micro heat pipes with multi-heat sources and sinks

Subedi

Kim

Jang

et al. 2019

International Journal of Heat and Mass Transfer

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“…Passive cooling techniques, e.g. heat spreaders and pipes [1], [2], have so far failed to replicate the dissipation characteristics of their active counterparts. The dissipation characteristics define the thermal envelope which can be sustained without the device skin temperature exceeding a level that will cause discomfort or injury to the user; this temperature level is around 45°C [3]- [5].…”

Section: Introductionmentioning

confidence: 99%

Mitigating Interactive Performance Degradation From Mobile Device Thermal Throttling

Bantock

Al-Hashimi

Merrett

2021

IEEE Embedded Syst. Lett.

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Mobile devices are limited in mass and volume reducing the viability of active device cooling implementations, this requires the use of less effective passive techniques to maintain device skin temperature levels. Application performance demands on a modern mobile device are driven by sustained performance workloads, such as 3D games, Virtual and Augmented Reality. Mobile System-on-Chips have corresponding increases in performance through both architectural changes and frequency of operation increases; which has resulted in the peak power consumption exceeding the sustainable thermal envelope defined by device skin temperature requirements. Existing thermal throttling techniques mitigate this by capping the frequency of operation of the System-on-Chip. Through experimentation with a modern smartphone platform using sequences from realworld applications, we demonstrate in this paper that Frequency Capping can have a significant effect on the performance of interactive applications, increasing the number of frame rate defects by up to 146%. We propose Task Utilization Scaling, a new lever for thermal throttling, which scales performance for critical interactive periods by the same factor as noncritical periods. Experiments demonstrate that the proposed approach can result in a decrease in frame rate defects of up to 18% compared with Frequency Capping or a skin temperature reduction of up to 2°C.

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Experimental and computational evaluation of phase change materials for handheld computing

Kanapady

Moore²,

Raghupathy³

et al. 2016

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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On the Thermal Management Challenges in Next Generation Handheld Devices

Cited by 8 publications

References 0 publications

Effect of mesh wick geometry on the maximum heat transfer rate of flat-micro heat pipes with multi-heat sources and sinks

Effect of mesh wick geometry on the maximum heat transfer rate of flat-micro heat pipes with multi-heat sources and sinks

Mitigating Interactive Performance Degradation From Mobile Device Thermal Throttling

Experimental and computational evaluation of phase change materials for handheld computing

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