Abstract:Extensive understanding and management of the thermal-mechanical characteristics of novel packaging designs during the bonding process are indispensable to the realization of the technologies. Thus, this paper attempts to explore the bonding process-induced thermal-mechanical behaviors of an advanced flip chip (FC) electronic packaging. FC packaging employs a novel anisotropic conductive film, which is a thin composite film composed of polymer matrix and thousands of millions of highly oriented, 1-D silver (Ag… Show more
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