2003
DOI: 10.1109/led.2003.816579
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On the thermal stability of atomic layer deposited TiN as gate electrode in MOS devices

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Cited by 112 publications
(65 citation statements)
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“…Fabrication of the MWCNT electrode involved the preparation of a CoSi 2 surface to act as a base layer, and as part of that process a 20 nm thick TiN fi lm was used as a capping layer to prevent oxidation of Co during silicidation. [ 34 ] Both of these materials can act as electrodes, [ 35 ] and have work functions in the same region as MWCNTs ( − 4.62 eV for CoSi 2 [ 36 , 37 ] and − 4.8 eV for TiN [ 38 ] compared to − 4.95 eV for MWCNTs [ 39 ] (Figure 1 b)). However both CoSi 2 and TiN are markedly more hydrophilic than MWCNTs, yielding contact angles with a droplet of water of 53.2 ° and 64.3 ° , respectively ( Figure S2; Supporting Information), intermediate between previously measured values for a Pt electrode (93.8 ° ) [ 26 ] and for the highly hydrophilic FTO-glass front electrode (18.7 ° ).…”
Section: Resultsmentioning
confidence: 99%
“…Fabrication of the MWCNT electrode involved the preparation of a CoSi 2 surface to act as a base layer, and as part of that process a 20 nm thick TiN fi lm was used as a capping layer to prevent oxidation of Co during silicidation. [ 34 ] Both of these materials can act as electrodes, [ 35 ] and have work functions in the same region as MWCNTs ( − 4.62 eV for CoSi 2 [ 36 , 37 ] and − 4.8 eV for TiN [ 38 ] compared to − 4.95 eV for MWCNTs [ 39 ] (Figure 1 b)). However both CoSi 2 and TiN are markedly more hydrophilic than MWCNTs, yielding contact angles with a droplet of water of 53.2 ° and 64.3 ° , respectively ( Figure S2; Supporting Information), intermediate between previously measured values for a Pt electrode (93.8 ° ) [ 26 ] and for the highly hydrophilic FTO-glass front electrode (18.7 ° ).…”
Section: Resultsmentioning
confidence: 99%
“…Conductive metal nitrides such as titanium nitride and tantalum nitride have been investigated as metal gate electrodes to solve challenging issues such as boron penetration and gate depletion, associated with polysilicon gate electrodes. However, most of them suffer from thermal instability of effective work function after high temperature annealing [1][2][3][4]. The use of amorphous ternary M-Si-N (M =Ta, Mo, W) as a diffusion barrier for Al or Cu metallization has been previously studied [5][6], and the use of TaSi X N Y as a metal gate electrode candidate has been recently reported [7].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the heavily doped polycrystalline silicon gate electrode may have to be replaced with metal electrodes. Midgap gate electrode metals, such as TiN, are being extensively investigated [1][2][3][4]. The metal/dielectric and the dielectric/Si interface determine the CMOS device performance, including channel mobility and threshold voltage.…”
mentioning
confidence: 99%