One-dimensional modeling of TE devices considering temperature-dependent parameters using SPICE

Mitrani, Daniel; Soler, Jordi; Turó, A.; García, M.J.; Chávez, J.A.

doi:10.1016/j.mejo.2008.04.001

Cited by 60 publications

(31 citation statements)

References 12 publications

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“…Using (17) in (16) yields an approximation of the flux at x i−1/2 in terms of the average temperatures on either side of the interface…”

Section: Discretizing the Boundary Conditions 1) Boundary Conditiomentioning

confidence: 99%

“…The experiment and simulation are compared with the results of a very simplified model. In this simple model, the three regions are treated as bulk objects (N I = N II = N III = 1) that are thermally coupled but have no thermoelectric properties: the ODE (10) in regions I and III, the ODE (11) with σ = 0 in region II, and the boundary conditions (16) at the interfaces B and C. At each moment in time, the temperatures at B and C are constructed using (17) and their difference is multiplied by α av to produce an approximate voltage across the thermoelectric region as a function of time (see Fig. 10).…”

Section: B Time-dependent Solutionsmentioning

confidence: 99%

“…Due to the ease with which electrical circuits can be used to study the heat equation, circuit models are commonly applied to thermoelectric problems. Examples found in the literature range from lumped equivalent circuits [13]- [15] to distributed circuits [16], [17]. Many of these are overly simplified and do not properly account for the physics of the device, including the temperature dependence of the Seebeck coefficient.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Time-Dependent Finite-Volume Model of Thermoelectric Devices

Yan

Dawson

Pugh

et al. 2014

IEEE Trans. on Ind. Applicat.

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Thermoelectric modules are an important alternative to heat engines in the harvesting of waste heat. Electrical-thermal analogs are often employed when studying heat conduction and this approach can be extended to develop a model for thermoelectric effects. In this article, the coupled thermoelectric partial differential equations are discretized using the finite-volume method; the discretization respects the coupling between the heat sink and the thermoelectric material. The new model is especially useful when an accurate picture of transients in a thermoelectric device is required. Results from the 1-D finite-volume model are shown to agree with experimental results as well as 3-D simulations using COMSOL.

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“…Using (17) in (16) yields an approximation of the flux at x i−1/2 in terms of the average temperatures on either side of the interface…”

Section: Discretizing the Boundary Conditions 1) Boundary Conditiomentioning

confidence: 99%

Section: B Time-dependent Solutionsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Time-Dependent Finite-Volume Model of Thermoelectric Devices

Yan

Dawson

Pugh

et al. 2014

IEEE Trans. on Ind. Applicat.

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“…Detailed SPICE models have been presented in [12] and [13], but these models only model the thermoelectric material and do not include the contact resistance effects and integration within a full package.…”

Section: Related Workmentioning

confidence: 99%

Control Principles and On-Chip Circuits for Active Cooling Using Integrated Superlattice-Based Thin-Film Thermoelectric Devices

Alexandrov¹,

Sullivan²,

Song³

et al. 2014

IEEE Trans. VLSI Syst.

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Superlattice thin-film thermoelectric coolers (TECs) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of ondemand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). Using thermal compact models of the chip and package with integrated TECs, the control principles for TEC-assisted transient cooling are presented. The control principles are implemented in a 130-nm CMOS process and cosimulated with the thermal system to show their feasibility and energy overheads. The simulation results show potential for extending the time for which a chip and package can sustain a high power load.

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“…3 It has also comprised work done using the mathematical package SPICE for numerical modeling. [4][5][6] Quasi-steady-state modeling of thermoelectric generators (TEG) integrated into automotive systems in ADVISOR was also conducted. 7,8 Numerical optimization studies have also been executed for segmented elements.…”

Section: Introductionmentioning

confidence: 99%

An Introduction to System-Level, Steady-State and Transient Modeling and Optimization of High-Power-Density Thermoelectric Generator Devices Made of Segmented Thermoelectric Elements

Crane¹

2010

Journal of Elec Materi

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High-power-density, segmented, thermoelectric (TE) elements have been intimately integrated into heat exchangers, eliminating many of the loss mechanisms of conventional TE assemblies, including the ceramic electrical isolation layer. Numerical models comprising simultaneously solved, nonlinear, energy balance equations have been created to simulate these novel architectures. Both steady-state and transient models have been created in a MATLAB/Simulink environment. The models predict data from experiments in various configurations and applications over a broad range of temperature, flow, and current conditions for power produced, efficiency, and a variety of other important outputs. Using the validated models, devices and systems are optimized using advanced multiparameter optimization techniques. Devices optimized for particular steady-state operating conditions can then be dynamically simulated in a transient operating model. The transient model can simulate a variety of operating conditions including automotive and truck drive cycles.

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One-dimensional modeling of TE devices considering temperature-dependent parameters using SPICE

Cited by 60 publications

References 12 publications

Time-Dependent Finite-Volume Model of Thermoelectric Devices

Time-Dependent Finite-Volume Model of Thermoelectric Devices

Control Principles and On-Chip Circuits for Active Cooling Using Integrated Superlattice-Based Thin-Film Thermoelectric Devices

An Introduction to System-Level, Steady-State and Transient Modeling and Optimization of High-Power-Density Thermoelectric Generator Devices Made of Segmented Thermoelectric Elements

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