Optical IMEMS/sup /spl reg//-a fabrication process for MEMS optical switches with integrated on-chip electronics

Brosnihan, Tim; Brown, Stephanie; Brogan, A.; Gormley, C.; Collins, D.; Sherman, Steve; Lemkin, M.; Polce, N.A.; Davis, Montenegro

doi:10.1109/sensor.2003.1217096

Cited by 25 publications

(9 citation statements)

References 6 publications

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“…The CNM Institute of Microelectronics in Barcelona, Spain, has also developed an SOI-based integration platform in which the MEMS structures are fabricated in the device layer, whereas the CMOS circuits are fabricated in the bulk silicon 83 . This optical iMEMS technology platform 84 was developed for the integration of high-quality micro-mirrors with a BiCMOS process. Instead of using standard SOI wafers, the iMEMS process is based on a three-layer silicon stack that is formed through wafer bonding.…”

Section: Cmos Device Areamentioning

confidence: 99%

Integrating MEMS and ICs

et al. 2015

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The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs typically provide functionalities related to the signals of these transducers, such as analog-to-digital conversion, amplification, filtering and information processing as well as communication between the MEMS transducer and the outside world. Thus, the vast majority of commercial MEMS products, such as accelerometers, gyroscopes and micro-mirror arrays, are integrated and packaged together with ICs. There are a variety of possible methods of integrating and packaging MEMS and IC components, and the technology of choice strongly depends on the device, the field of application and the commercial requirements. In this review paper, traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed. These include approaches based on the hybrid integration of multiple chips (multi-chip solutions) as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques. These are important technological building blocks for the 'More-ThanMoore' paradigm described in the International Technology Roadmap for Semiconductors. In this paper, the various approaches are categorized in a coherent manner, their merits are discussed, and suitable application areas and implementations are critically investigated. The implications of the different MEMS and IC integration approaches for packaging, testing and final system costs are reviewed.

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Section: Cmos Device Areamentioning

confidence: 99%

Integrating MEMS and ICs

et al. 2015

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“…Monolithic integration enables the realization of all required system functionalities onto a single chip. In the Microsystems arena, electronics and MEMS elements have been brought together in one manufacturing process [7][8][9][10]. Optoelectronic integration is no different, but the process must be able to integrate both optical and electrical components on to a single chip.…”

Section: Monolithically Integrated Optical Encodermentioning

confidence: 99%

Miniaturised optical encoder for ultra precision metrology systems

Carr

Desmulliez

Weston

et al. 2009

Precision Engineering

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“…The flow rates, Q seal and Q dc , through the seal and driving channel can be found by integrating equations (9) and (10) across the channel where t is the thickness of the rotor:…”

Section: Fluidic Modelmentioning

confidence: 99%

Feasibility Study of a MEMS Viscous Rotary Engine Power System (VREPS)

2004

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In this paper is presented an analytic, theoretical and numerical study of the Viscous Rotary Engine Power System (VREPS). In addition, a proposed process flow for the fabrication of the VREPS using DRIE of silicon is described. The design premise of the VREPS is to derive mechanical power from the surface viscous shearing forces developed by a pressure driven flow present between a rotating disk or annulus and a stationary housing. The resulting motion of the rotating disk or annulus is converted into electrical power by using an external permanent magnet, embedded nickel-iron magnetic circuits, and an external switched magnetic pole electric generator similar to the design proposed by M. Senesky for the UC Berkeley micro-Wankel Engine [1]. This paper will examine the power output, isentropic efficiency, and operating characteristics of the disk and annular viscous turbines using the lubrication approximation and the Creeping Flow Equations (Stokes Flow). The viscous turbine is optimized for maximum isentropic efficiency using MATLAB numerical optimization routines. Finally, a unique triple-wafer micro-fabrication process for VREPS is presented. The proposed design consists of a 250 μm thick, 3.4 mm OD / 2.4 mm ID annular rotor with embedded magnetic poles and four 10 μm driving channels on each side of the rotor. Electrical power is generated with a switched magnetic pole generator, external permanent magnet, and integrated magnetic circuits. Calculations with water predict an output power of 825 mW at an isentropic efficiency of 25% using a pressure drop of 5 MPa cross the device.

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Optical IMEMS/sup /spl reg//-a fabrication process for MEMS optical switches with integrated on-chip electronics

Cited by 25 publications

References 6 publications

Integrating MEMS and ICs

Integrating MEMS and ICs

Miniaturised optical encoder for ultra precision metrology systems

Feasibility Study of a MEMS Viscous Rotary Engine Power System (VREPS)

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