Optical versus Electrical Interconnections for Clock Distribution Networks in New VLSI Technologies

Tosik, G.; Gaffiot, F.; Lisik, Zbigniew; O’Connor, Ian; Tissafi-Drissi, F.

doi:10.1007/978-3-540-39762-5_52

Cited by 8 publications

(8 citation statements)

References 15 publications

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“…The power dissipated in the electrical system can be attributed to the charging and discharging of the wiring and load capacitance and to the static power dissipated by the buffers. In order to calculate the power we used an internally developed simulator, which allows us to model and calculate the electrical parameters of clock networks for future technology nodes [29]. Fig.…”

Section: Clock Distributionmentioning

confidence: 99%

Optical solutions for system-level interconnect

O’Connor

2004

Proceedings of the 2004 International Workshop on System Level Interconnect Prediction

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Throughput, power consumption, signal integrity, pin count and routing complexity are all increasingly important interconnect issues that the system designer must deal with. Recent advances in integrated optical devices may deliver alternative interconnect solutions enabling drastically enhanced performance. This paper begins by outlining some of the more pressing issues in interconnect design, and goes on to describe system-level optical interconnect for inter-and intra-chip applications. Inter-chip optical interconnect, now a relatively mature technology, can enable greater connectivity for parallel computing for example through the use of optical I/O pads and wavelength division multiplexing. Intra-chip optical interconnect, technologically challenging and requiring new design methods, is presented through a proposal for heterogeneous integration of a photonic "above-IC" layer followed by a design methodology for on-chip optical links. Design technology issues are highlighted and the paper concludes with examples of the use of optical links in clock distribution (with quantitative comparisons of dissipated power between electrical and optical clock distribution networks) and for novel network on chip architectures.

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Section: Clock Distributionmentioning

confidence: 99%

Optical solutions for system-level interconnect

O’Connor

2004

Proceedings of the 2004 International Workshop on System Level Interconnect Prediction

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“…The increase in the integration density in the field of microelectronics will lead to a technological bottleneck regarding interconnects. More precisely, the use of traditional metallic connections will yield a dramatic increase of power consumption as well as a lack of synchronism, particularly for the longest links positioned on top of the circuits (30). An optical link that includes a laser source, an optical waveguide and a photo detector, could be integrated with microelectronic circuits and offer an appealing alternative to conventional metallic interconnects (31).…”

Section: Bonding For Photonic Device: Full Optical Link Integrated On...mentioning

confidence: 99%

New Heterostructures and 3D Devices Obtained at CEA/LETI by the Bonding and Thinning Method

Cioccio¹

2006

ECS Trans.

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“…Circuitscale predictive simulation showed that such optical links should exhibit high efficiency, low power consumption and low footprint [1] An approach based on hybridation of AlGaInAs on Silicon, and evanescent coupling was recently proposed, and promising results were obtained [2]. However, this approach does not enable drastic reduction of the laser source dimension and threshold.…”

Section: Introductionmentioning

confidence: 97%

Integration of an Electrically Driven InGaAsP Based Microdisk Laser with a Silicon based Passive Photonic Circuit

Rojo-Romeo¹,

Campenhout

Mandorlo

et al. 2007

2007 Conference on Lasers and Electro-Optics (CLEO)

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Electrically driven InGaAsP based microdisk lasers are bonded on a 200 mm SOI Wafer with submicron Silicon waveguides. Experimental results at room temperature of electrically pumped lasers coupled to a Si waveguide are exposed. IntroductionIn order to develop new optical links for future optical interconnects, a key issue is to fabricate an efficient optical microlaser connected with an optical waveguide that can be integrated on top of a silicon integrated circuit. Circuitscale predictive simulation showed that such optical links should exhibit high efficiency, low power consumption and low footprint [1] An approach based on hybridation of AlGaInAs on Silicon, and evanescent coupling was recently proposed, and promising results were obtained [2]. However, this approach does not enable drastic reduction of the laser source dimension and threshold. A few years ago, we proposed an original approach that consists in heterogeneous integration of high optical confinement InP-based photonic structures onto silicon [3] Coupling such ultracompact optical source with high index contrast passive waveguide could enable the implementation of efficient optical links on top of a silicon circuit.In order to implement such optical links, we selected photonic devices that use relatively mature concepts and that in the same time enable a high compactness.: InP-based microdisk lasers, and optical waveguides with sub-micron dimensions, patterned in an Silicon-on-Insulator (SOI) wafer. Microdisk lasers have been extensively studied in the past decade, both under optical and electrical pumping. In case of electrical injection, most of the structures are pedestal disks realized in a thick membrane [4]. In this communication, we focus on the design, fabrication and preliminary test of an heterogeneous system composed of an electrically pumped laser that uses a thin InP heterostructure and passive photonic circuit based on a nanostructured 200 mm SOI wafer.

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Optical versus Electrical Interconnections for Clock Distribution Networks in New VLSI Technologies

Cited by 8 publications

References 15 publications

Optical solutions for system-level interconnect

Optical solutions for system-level interconnect

New Heterostructures and 3D Devices Obtained at CEA/LETI by the Bonding and Thinning Method

Integration of an Electrically Driven InGaAsP Based Microdisk Laser with a Silicon based Passive Photonic Circuit

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