Optimization and characterization of wafer-level adhesive bonding with patterned dry-film photoresist for 3D MEMS integration

Huesgen, Till; Lenk, Gabriel; Albrecht, Björn; Vulto, Paul; Lemke, Thomas; Woias, Peter

doi:10.1016/j.sna.2010.06.008

Cited by 38 publications

(31 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Recently, dry film photopolymers have moved away from their original purpose of providing sacrificial layers for the fabrication of printed circuit boards and were used for fabricating electroplating moulds [34,35], stamp cavities [36] and replication tools [37,38], for wafer bonding [39,40] and sensor packaging [41], as an etch mask for silicon-DRIE [42] and as a permanent material for microfluidic applications [43][44][45][46]. So far, the most frequently used permanent films are Riston (DuPont) and Ordyl SY (Elga Europe).…”

Section: Selective Sealing Of Silicon Microchannelsmentioning

confidence: 99%

Microfluidics in silicon/polymer technology as a cost-efficient alternative to silicon/glass

Kalkandjiev

Riegger

Kosse

et al. 2011

J. Micromech. Microeng.

View full text Add to dashboard Cite

We investigate TMMF photopolymer as a cost-efficient alternative to glass for the leak-tight sealing of high-density silicon microchannels. TMMF enables low temperature sealing and access to structures underneath via lamination and standard UV-lithography instead of costly glass machining and anodic bonding. TMMF is highly transparent and has a low autofluorescence for wavelengths larger than 400 nm. As the photopolymer is too thin for implementing bulky world-to-chip interfaces, we propose adhesive bonding of cyclic olefin copolymer (COC) modules. All materials were tested according ISO 10993-5 and showed no cytotoxic effects on the proliferation of L929 cells. To quantify the cost efficiency of the proposed techniques, we used an established silicon/Pyrex nanoliter dispenser as a reference and replaced structured Pyrex wafers by TMMF laminates and COC modules. Thus, consumable costs, manpower and machine time related to sealing of the microchannels and implementing the world-to-chip interface could be significantly reduced. Leak tightness was proved by applying a pressure of 0.2 MPa for 5 h without delamination or crosstalk between neighboring microchannels located only 100 μm apart. In contrast to anodic bonding, the proposed techniques are tolerant to surface inhomogeneities. They enable manufacturing of silicon/polymer microfluidics at lower costs and without compromising the performance compared to corresponding silicon/glass devices.

show abstract

Section: Selective Sealing Of Silicon Microchannelsmentioning

confidence: 99%

Microfluidics in silicon/polymer technology as a cost-efficient alternative to silicon/glass

Kalkandjiev

Riegger

Kosse

et al. 2011

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…The microfluidic chamber is formed by bonding the glass wafers and the Si-spacer together with 60 µm thick layers of patterned dry-film-resist (Ordyl) as the adhesive intermediate layers. This full wafer-level adhesive bonding technique creates leak-tight bonds of high strength (13.4 MPa) and high bond yield (> 95%) [8]. Fig.…”

Section: Fabricationmentioning

confidence: 99%

Bistable optofluidic attenuator with integrated electrowetting actuation and high dynamic range

Müller

Kloss

Mönch

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

View full text Add to dashboard Cite

We present a novel miniaturized transmission-type optical attenuator based on optofluidic technology. A microfluidic chip has been developed which is fabricated on wafer scale, based on full-wafer-bonding with a dry film resist. The optical transmission of the chip can be changed simply by displacing a highly absorbent liquid with a transparent one. Due to the integration of an electrowetting actuator for driving the liquids, the attenuator is ultra-compact (11 × 23 × 1.6 mm 3 ) and does not need any external components. When using oil soluble dyes as the absorbent liquid, various transmission spectra can be defined. Depending on the input wavelength range, attenuations as high as 47 dB can be reached, while the switching times for a 2 mm aperture can be as low as 100 ms.

show abstract

“…Recently, dry film photoresists have moved away from their original purpose of providing sacrificial layers for the fabrication of printed circuit boards and were used to manufacture electroplating molds [34], replication tools [35], for wafer bonding [36] and sensor packaging [47], as an etch mask for silicon-DRIE [38] and as a permanent material for microfluidic applications [39].…”

Section: Introductionmentioning

confidence: 99%

Direct assembly of cyclic olefin copolymer microfluidic devices helped by dry photoresist

Fissi¹,

Vandormael²,

Francis³

2015

Sensors and Actuators A: Physical

View full text Add to dashboard Cite

Optimization and characterization of wafer-level adhesive bonding with patterned dry-film photoresist for 3D MEMS integration

Cited by 38 publications

References 13 publications

Microfluidics in silicon/polymer technology as a cost-efficient alternative to silicon/glass

Microfluidics in silicon/polymer technology as a cost-efficient alternative to silicon/glass

Bistable optofluidic attenuator with integrated electrowetting actuation and high dynamic range

Direct assembly of cyclic olefin copolymer microfluidic devices helped by dry photoresist

Contact Info

Product

Resources

About