Direct assembly of cyclic olefin copolymer microfluidic devices helped by dry photoresist

Fissi, Lamia El; Vandormael, Denis; Francis, Laurent

doi:10.1016/j.sna.2014.12.016

Cited by 16 publications

(7 citation statements)

References 48 publications

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“…Use of plasma surface modification along with TEOS treatment can remove the need for strong solvent and high temperature for the bonding of microfluidic devices [ 92 ]. Plasma treatment of 4 min on a COC surface decreased the contact angle from 88° to 7°, which enhanced bonding strength [ 93 ]. Oxygen plasma treatment was also used to assist the bonding of PMMA and PDMS layers at room temperature using biocompatible adhesive tape [ 94 ].…”

Section: Direct Bondingmentioning

confidence: 99%

“…The bonding strength of liquid adhesive was reported to be around 10~800 kPa [ 134 , 135 ] for SU-8 adhesive 27 MPa [ 119 ], while the bonding strength of dry-adhesive film was reported to be around 32 kPa [ 139 ]. However, for dry-film photo-resist, the shear strength of 28 MPa was obtained for 4 min of oxygen plasma treatment while bonding COC substrates [ 93 ].…”

Section: Indirect Bondingmentioning

confidence: 99%

“…Surface treatment can enhance the bonding strength as observed in COC substrates bonding using ORDYL photoresist in which shear strength of 28 MPa can be achieved, when substrates were treated with oxygen plasma for 4 min. [ 93 ].…”

Section: Indirect Bondingmentioning

confidence: 99%

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Recent Advances in Thermoplastic Microfluidic Bonding

Giri

Tsao

2022

Micromachines

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Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.

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Section: Direct Bondingmentioning

confidence: 99%

Section: Indirect Bondingmentioning

confidence: 99%

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Recent Advances in Thermoplastic Microfluidic Bonding

Giri

Tsao

2022

Micromachines

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“…Laser ablation and micro-milling are typical direct processing processes [7][8][9][10], which can be used for rapid prototyping of micro uidic chips. Both methods can be used to process a variety of materials, including polymer materials, such as polymethylmethacrylate (PMMA) [11], polycarbonate (PC) [12], polyethylene terephthalate (PET) [13] and cyclic ole n copolymer (COC) [14], which are generally used in micro uidic chips. However, in the process of laser ablation, it is very common for debris to redeposit on the sidewall and oor.…”

Section: Introductionmentioning

confidence: 99%

Effect of the inclined angle of micromilling tool on the fabrication of the microfluidic channel

Geng

Zhang

Wang

et al. 2023

Int J Adv Manuf Technol

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Micro-milling is a common processing method for fabricating micro uidic chips or other micro products with high processing accuracy and low cost, suitable for mass production. The main concern of micromilling is the surface roughness of the machined surface. However, the general study of the surface roughness of micro-milling can only nd that only a small range of surface roughness can be obtained by changing the processing parameters. It is very di cult to obtain a speci c roughness. In the process of micro-milling with end mills, due to the structural characteristics of the tool tip, the inclination angle of the tool will have a signi cant impact on the bottom surface of the machined channels. In this work, the in uence of tool inclination on the surface roughness of machining was studied through the machining tests of inclined micro-milling on a poly(methyl methacrylate) (PMMA) surface, and it was proposed to realize the control of the machined surface roughness by inclined micro-milling. In addition, a theoretical model considering tool inclination was established to calculate the surface roughness of the machined bottom obtained by inclined micro-milling. The experimental results are consistent with the theoretical model results in the lower speed range. Afterwards, the polydimethylsiloxane (PDMS) is used to replicate the microchannel machined on the PMMA surface, and the micro uidic chips were prepared to control the uid ow in the channel by adjusting the roughness of the bottom of the channel. Results show that the smoother channel will ow rst under the same ow pressure. The study offers a new idea of surface roughness control, which can be applied to ow control in micro uidic chips.

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“…Adhesive, thermo-compressive bonding using various types of polymer interlayer materials has been investigated extensively in the past, and identified as a suitable approach to realize microfluidic devices. [15][16][17][18][19] Permanent photosensitive dry-films (DFRs) such as ORDYL [20][21][22][23][24][25][26][27] (Resistechno S.r. l. and Elga Europe S.r.l., Italy, 28) Datasheet), TMMF [29][30][31] (Tokyo Ohka Kogyo Co. Ltd., Japan) and other brands [32][33][34] have been successfully used for adhesive wafer bonding.…”

Section: Introductionmentioning

confidence: 99%

Adhesive wafer bonding for CMOS based lab-on-a-chip devices

Karl¹,

Schikowski²,

Thon³

et al. 2020

Jpn. J. Appl. Phys.

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Adhesive wafer bonding using laminated photosensitive dry-resist offers many advantages and can be used to realize advanced, CMOS integrated, lab-on-a-chip devices. The low bond-temperatures involved allow the hybrid integration of a range of substrates, e.g. CMOS wafers with structured MEMS glass wafers. The dry-film polymer functions as an adhesive interlayer and can be lithographically patterned to form sealed microfluidic fluid channels and chambers. This approach is well suited for low-cost R&D prototyping, and efforts reported in the past were often limited to proof-of-concept devices. However, all of the involved process steps do have the potential to be scaled up for an industrial volume production. We report on our activities to implement a baseline 8″ process flow, using the ORDYL SY300 series of permanent dry-film resist, to enable the commercial manufacturing of microfluidic devices based on this technology at a MEMS foundry. Advantages and disadvantages of the presented approach are discussed.

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Direct assembly of cyclic olefin copolymer microfluidic devices helped by dry photoresist

Cited by 16 publications

References 48 publications

Recent Advances in Thermoplastic Microfluidic Bonding

Recent Advances in Thermoplastic Microfluidic Bonding

Effect of the inclined angle of micromilling tool on the fabrication of the microfluidic channel

Adhesive wafer bonding for CMOS based lab-on-a-chip devices

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